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ATS-X50170B-C1-R0 Datasheet with Chat AI
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  • Part No.ATS-X50170B-C1-R0
    ManufacturerATS
    Size646 Kbytes
    Pages1 page
    DescriptionHigh Performance BGA Cooling
    Datasheet Summary with AI

    # ATS-X50170B-C1-R0 - High Performance BGA Cooling Solutions

    ## Product Details

    ️· Part Number: ATS-X50170B-C1-R0
    ️· Dimensions:
    - Length: 17 mm
    - Width: 17 mm
    - Height: 7.5 mm
    - Fin Tip to Fin Tip: 28.4 mm
    ️· Material: Chomerics T766
    ️· Finish: Blue-Anodized
    ️· Designed for: 17 x 17 mm BGA components
    ️· Notes:
    - Dimensions of the heat sink are subject to tolerances of up to .99 mm.
    - Thermal performance data is for reference only; actual performance may vary.
    - ATS reserves the right to update product specifications.
    - Lead time: minimum 4-6 weeks.
    - Custom options available - contact ATS.

    ## Features & Benefits

    ️· superGRIP™ Attachment: Allows for detachment and reattachment without damage to component or PCB.
    ️· Strong Attachment Force: Maximizes performance with phase-changing TIMs.
    ️· Holeless Mounting: Eliminates need for PCB mounting holes.
    ️· maxiFLOW™ Heat Sink: Maximizes convection (air) cooling.
    ️· Phase Change Material: Uses clean-break, reworkable Chomerics T-766 phase change material.
    ️· Space-Saving Design: Ideal for densely populated PCBs.

    ## Thermal Performance

    ️· Air Velocity & Thermal Resistance:
    - 200 FT/MIN (1.0 m/s): 18.2 °C/W (unducted), 13.9 °C/W (ducted)
    - 300 FT/MIN (1.5 m/s): 14.8 °C/W (unducted), 17 mm (ducted)
    - 400 FT/MIN (2.0 m/s): 12.8 °C/W (unducted)
    - 500 FT/MIN (2.5 m/s): 11.4 °C/W (unducted)
    - 600 FT/MIN (3.0 m/s): 10.4 °C/W (unducted)
    - 700 FT/MIN (3.5 m/s): 9.7 °C/W (unducted)
    - 800 FT/MIN (4.0 m/s): 9 °C/W (unducted)

    ## Contact Information

    ️· Website: www.qats.com
    ️· North America: 781.769.2800
    ️· Europe: +31 (0) 3569 84715

    # ATS-X50170B-C1-R0 - High Performance BGA Cooling Solutions

    ## Product Details

    ️· Part Number: ATS-X50170B-C1-R0
    ️· Dimensions:
    - Length: 17 mm
    - Width: 17 mm
    - Height: 7.5 mm
    - Fin Tip to Fin Tip: 28.4 mm
    ️· Material: Chomerics T766
    ️· Finish: Blue-Anodized
    ️· Designed for: 17 x 17 mm BGA components
    ️· Notes:
    - Dimensions of the heat sink are subject to tolerances of up to .99 mm.
    - Thermal performance data is for reference only; actual performance may vary.
    - ATS reserves the right to update product specifications.
    - Lead time: minimum 4-6 weeks.
    - Custom options available - contact ATS.

    ## Features & Benefits

    ️· superGRIP™ Attachment: Allows for detachment and reattachment without damage to component or PCB.
    ️· Strong Attachment Force: Maximizes performance with phase-changing TIMs.
    ️· Holeless Mounting: Eliminates need for PCB mounting holes.
    ️· maxiFLOW™ Heat Sink: Maximizes convection (air) cooling.
    ️· Phase Change Material: Uses clean-break, reworkable Chomerics T-766 phase change material.
    ️· Space-Saving Design: Ideal for densely populated PCBs.

    ## Thermal Performance

    ️· Air Velocity & Thermal Resistance:
    - 200 FT/MIN (1.0 m/s): 18.2 °C/W (unducted), 13.9 °C/W (ducted)
    - 300 FT/MIN (1.5 m/s): 14.8 °C/W (unducted), 17 mm (ducted)
    - 400 FT/MIN (2.0 m/s): 12.8 °C/W (unducted)
    - 500 FT/MIN (2.5 m/s): 11.4 °C/W (unducted)
    - 600 FT/MIN (3.0 m/s): 10.4 °C/W (unducted)
    - 700 FT/MIN (3.5 m/s): 9.7 °C/W (unducted)
    - 800 FT/MIN (4.0 m/s): 9 °C/W (unducted)

    ## Contact Information

    ️· Website: www.qats.com
    ️· North America: 781.769.2800
    ️· Europe: +31 (0) 3569 84715

    Part No.ATS-X50170B-C1-R0
    ManufacturerATS
    Size646 Kbytes
    Pages1 page
    DescriptionHigh Performance BGA Cooling
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