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Hello, Please ask a question about ATS-X50210B-C1-R0 Datasheet
# Example questions:
➢ How does the thermal resistance change when using ducted versus unducted airflow at a velocity of 500 ft/min?
➢ What is the typical lead time required to receive this product after placing an order?
➢ What are the dimensions of the heat sink, specifically its length, width, and height?
# High Performance BGA Cooling Solutions w/ superGRIP™ Attachment
## Product Details
️· ATS Part #: ATS-X50210B-C1-R0
️· Dimensions:
- Length: 21 mm
- Width: 21 mm
- Height: 7.5 mm
- Fin Tip to Fin Tip: 34.6 mm
️· Material: Chomerics T766
️· Finish: Blue-Anodized
️· Designed for: 21 x 21 mm BGA components
️· Notes:
- Length and width refer to the component size.
- Heat sink dimensions have tolerances up to 0.99mm.
- Thermal performance data are for reference only.
- ATS reserves the right to update product specifications.
- Custom options are available, contact ATS for details.
- Typical lead time: 4-6 weeks
## Features & Benefits
️· superGRIP™ Attachment: Allows heat sink detachment and reattachment without component or PCB damage.
️· Strong Attachment: Provides uniform force for optimal performance with phase-changing TIMs.
️· No Mounting Holes: Eliminates the need to drill holes in the PCB.
️· maxiFLOW™ Heat Sink: Maximizes convection (air) cooling.
️· Phase Change Material: Includes clean break, reworkable Chomerics T-766.
## Thermal Performance
️· Air Velocity & Thermal Resistance:
| Air Velocity (FT/MIN) | Air Velocity (M/S) | Thermal Resistance (Unducted Flow °C/W) | Thermal Resistance (Ducted Flow °C/W) |
|---|---|---|---|
| 200 | 1.0 | 11.9 | 8.8 |
| 300 | 1.5 | 9.5 | 8.2 |
| 400 | 2.0 | 8.2 | 7.3 |
| 500 | 2.5 | 7.3 | 6.7 |
| 600 | 3.0 | 6.7 | 6.2 |
| 700 | 3.5 | 6.2 | 5.8 |
| 800 | 4.0 |
# High Performance BGA Cooling Solutions w/ superGRIP™ Attachment
## Product Details
️· ATS Part #: ATS-X50210B-C1-R0
️· Dimensions:
- Length: 21 mm
- Width: 21 mm
- Height: 7.5 mm
- Fin Tip to Fin Tip: 34.6 mm
️· Material: Chomerics T766
️· Finish: Blue-Anodized
️· Designed for: 21 x 21 mm BGA components
️· Notes:
- Length and width refer to the component size.
- Heat sink dimensions have tolerances up to 0.99mm.
- Thermal performance data are for reference only.
- ATS reserves the right to update product specifications.
- Custom options are available, contact ATS for details.
- Typical lead time: 4-6 weeks
## Features & Benefits
️· superGRIP™ Attachment: Allows heat sink detachment and reattachment without component or PCB damage.
️· Strong Attachment: Provides uniform force for optimal performance with phase-changing TIMs.
️· No Mounting Holes: Eliminates the need to drill holes in the PCB.
️· maxiFLOW™ Heat Sink: Maximizes convection (air) cooling.
️· Phase Change Material: Includes clean break, reworkable Chomerics T-766.
## Thermal Performance
️· Air Velocity & Thermal Resistance:
| Air Velocity (FT/MIN) | Air Velocity (M/S) | Thermal Resistance (Unducted Flow °C/W) | Thermal Resistance (Ducted Flow °C/W) |
|---|---|---|---|
| 200 | 1.0 | 11.9 | 8.8 |
| 300 | 1.5 | 9.5 | 8.2 |
| 400 | 2.0 | 8.2 | 7.3 |
| 500 | 2.5 | 7.3 | 6.7 |
| 600 | 3.0 | 6.7 | 6.2 |
| 700 | 3.5 | 6.2 | 5.8 |
| 800 | 4.0 |
| Part No. | ATS-X50210B-C1-R0 |
| Manufacturer | ATS |
| Size | 647 Kbytes |
| Pages | 1 page |
| Description | High Performance BGA Cooling |
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