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ATS-X50210B-C1-R0 Datasheet with Chat AI
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  • Part No.ATS-X50210B-C1-R0
    ManufacturerATS
    Size647 Kbytes
    Pages1 page
    DescriptionHigh Performance BGA Cooling
    Datasheet Summary with AI

    # High Performance BGA Cooling Solutions w/ superGRIP™ Attachment

    ## Product Details
    ️· ATS Part #: ATS-X50210B-C1-R0
    ️· Dimensions:
    - Length: 21 mm
    - Width: 21 mm
    - Height: 7.5 mm
    - Fin Tip to Fin Tip: 34.6 mm
    ️· Material: Chomerics T766
    ️· Finish: Blue-Anodized
    ️· Designed for: 21 x 21 mm BGA components
    ️· Notes:
    - Length and width refer to the component size.
    - Heat sink dimensions have tolerances up to 0.99mm.
    - Thermal performance data are for reference only.
    - ATS reserves the right to update product specifications.
    - Custom options are available, contact ATS for details.
    - Typical lead time: 4-6 weeks

    ## Features & Benefits
    ️· superGRIP™ Attachment: Allows heat sink detachment and reattachment without component or PCB damage.
    ️· Strong Attachment: Provides uniform force for optimal performance with phase-changing TIMs.
    ️· No Mounting Holes: Eliminates the need to drill holes in the PCB.
    ️· maxiFLOW™ Heat Sink: Maximizes convection (air) cooling.
    ️· Phase Change Material: Includes clean break, reworkable Chomerics T-766.

    ## Thermal Performance
    ️· Air Velocity & Thermal Resistance:

    Air Velocity (FT/MIN) Air Velocity (M/S) Thermal Resistance (Unducted Flow °C/W) Thermal Resistance (Ducted Flow °C/W)
    200 1.0 11.9 8.8
    300 1.5 9.5 8.2
    400 2.0 8.2 7.3
    500 2.5 7.3 6.7
    600 3.0 6.7 6.2
    700 3.5 6.2 5.8
    800 4.0

    ## Contact Information
    ️· Website: www.qats.com
    ️· North America: 781.769.2800
    ️· Europe: +31 (0) 3569 84715

    # High Performance BGA Cooling Solutions w/ superGRIP™ Attachment

    ## Product Details
    ️· ATS Part #: ATS-X50210B-C1-R0
    ️· Dimensions:
    - Length: 21 mm
    - Width: 21 mm
    - Height: 7.5 mm
    - Fin Tip to Fin Tip: 34.6 mm
    ️· Material: Chomerics T766
    ️· Finish: Blue-Anodized
    ️· Designed for: 21 x 21 mm BGA components
    ️· Notes:
    - Length and width refer to the component size.
    - Heat sink dimensions have tolerances up to 0.99mm.
    - Thermal performance data are for reference only.
    - ATS reserves the right to update product specifications.
    - Custom options are available, contact ATS for details.
    - Typical lead time: 4-6 weeks

    ## Features & Benefits
    ️· superGRIP™ Attachment: Allows heat sink detachment and reattachment without component or PCB damage.
    ️· Strong Attachment: Provides uniform force for optimal performance with phase-changing TIMs.
    ️· No Mounting Holes: Eliminates the need to drill holes in the PCB.
    ️· maxiFLOW™ Heat Sink: Maximizes convection (air) cooling.
    ️· Phase Change Material: Includes clean break, reworkable Chomerics T-766.

    ## Thermal Performance
    ️· Air Velocity & Thermal Resistance:

    Air Velocity (FT/MIN) Air Velocity (M/S) Thermal Resistance (Unducted Flow °C/W) Thermal Resistance (Ducted Flow °C/W)
    200 1.0 11.9 8.8
    300 1.5 9.5 8.2
    400 2.0 8.2 7.3
    500 2.5 7.3 6.7
    600 3.0 6.7 6.2
    700 3.5 6.2 5.8
    800 4.0

    ## Contact Information
    ️· Website: www.qats.com
    ️· North America: 781.769.2800
    ️· Europe: +31 (0) 3569 84715

    Part No.ATS-X50210B-C1-R0
    ManufacturerATS
    Size647 Kbytes
    Pages1 page
    DescriptionHigh Performance BGA Cooling
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