# High Performance BGA Cooling Solutions w/ superGRIP™ Attachment

## Product Details
️· ATS Part #: ATS-X50230B-C1-R0
️· Dimensions:
- Length: 23 mm
- Width: 23 mm
- Height: 7.5 mm
- Fin Tip to Fin Tip: 37.5 mm
️· Interface Material: Chomerics T766
️· Finish: Blue-Anodized
️· Designed for: 23 x 23 mm BGA components

## Features & Benefits
️· Space Efficient: Requires minimal space around the component’s perimeter; ideal for densely populated PCBs.
️· Reworkable: Allows detachment and reattachment without damaging the component or PCB.
️· TIM Performance: Strong, uniform attachment force for optimal performance with phase-changing TIMs.
️· Holeless Mounting: Eliminates the need for PCB mounting holes.
️· maxiFLOW™ Heat Sink: Maximizes convection (air) cooling.
️· Phase Change Material: Includes clean break, reworkable Chomerics T-766 phase change material.

## Thermal Performance
️· Air Velocity (FT/MIN):
- 200: 1.0 °C/W (Unducted Flow) / 10.9 °C/W (Ducted Flow)
- 300: 1.5 °C/W (Unducted Flow) / 8.7 °C/W (Ducted Flow)
- 400: 2.0 °C/W (Unducted Flow) / 7.5 °C/W (Ducted Flow)
- 500: 2.5 °C/W (Unducted Flow) / 6.7 °C/W (Ducted Flow)
- 600: 3.0 °C/W (Unducted Flow) / 6.2 °C/W (Ducted Flow)
- 700: 3.5 °C/W (Unducted Flow) / 5.7 °C/W (Ducted Flow)
- 800: 4.0 °C/W (Unducted Flow) / 5.3 °C/W (Ducted Flow)

## Notes
️· Dimensions of the heat sink are subject to tolerances of up to .99 mm.
️· Thermal performance data are for reference only; actual performance may vary.
️· ATS reserves the right to update or change products.
️· Additional tooling fees and a minimum lead time of 4-6 weeks may be required.
️· Contact ATS for custom options.



For more information, visit www.qats.com or call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe).
REV0_042109