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Hello, Please ask a question about ATS-X50230G-C1-R0 Datasheet
# Example questions:
➢ How does the thermal resistance change as the air velocity increases from 200 ft/min to 800 ft/min?
➢ What type of phase change material is included as standard with this assembly?
➢ What are the dimensions of the heat sink designed for this product?
# High Performance BGA Cooling Solutions w/ superGRIP™ Attachment
## Product Details
️· ATS Part #: ATS-X50230G-C1-R0
️· Dimensions:
- Length: 23 mm
- Width: 23 mm
- Height: 12.5 mm
- Fin Tip to Fin Tip: 41.5 mm
️· Material: Chomerics T766
️· Finish: Blue-Anodized
️· Designed For: 23 x 23 mm BGA components
## Features & Benefits
️· Requires minimal space around the component, suitable for densely populated PCBs.
️· Allows heat sink detachment/reattachment without component/PCB damage.
️· Provides strong, uniform attachment force for optimal phase-changing TIM performance.
️· Eliminates the need for PCB mounting holes.
️· Includes a maxiFLOW™ heat sink for maximized convection cooling.
️· Uses a clean break, reworkable Chomerics T-766 phase change material.
## Thermal Performance
️· Air Velocity & Thermal Resistance:
| Air Velocity (FT/MIN) | M/S | Thermal Resistance (°C/W - Unducted Flow) | Thermal Resistance (°C/W - Ducted Flow) |
|---|---|---|---|
| 200 | 1.0 | 6.7 | 5.4 |
| 300 | 1.5 | 5.5 | 4.8 |
| 400 | 2.0 | 4.8 | 4.3 |
| 500 | 2.5 | 4.3 | 3.9 |
| 600 | 3.0 | 3.9 | 3.6 |
| 700 | 3.5 | 3.6 | 3.4 |
| 800 | 4.0 |
# High Performance BGA Cooling Solutions w/ superGRIP™ Attachment
## Product Details
️· ATS Part #: ATS-X50230G-C1-R0
️· Dimensions:
- Length: 23 mm
- Width: 23 mm
- Height: 12.5 mm
- Fin Tip to Fin Tip: 41.5 mm
️· Material: Chomerics T766
️· Finish: Blue-Anodized
️· Designed For: 23 x 23 mm BGA components
## Features & Benefits
️· Requires minimal space around the component, suitable for densely populated PCBs.
️· Allows heat sink detachment/reattachment without component/PCB damage.
️· Provides strong, uniform attachment force for optimal phase-changing TIM performance.
️· Eliminates the need for PCB mounting holes.
️· Includes a maxiFLOW™ heat sink for maximized convection cooling.
️· Uses a clean break, reworkable Chomerics T-766 phase change material.
## Thermal Performance
️· Air Velocity & Thermal Resistance:
| Air Velocity (FT/MIN) | M/S | Thermal Resistance (°C/W - Unducted Flow) | Thermal Resistance (°C/W - Ducted Flow) |
|---|---|---|---|
| 200 | 1.0 | 6.7 | 5.4 |
| 300 | 1.5 | 5.5 | 4.8 |
| 400 | 2.0 | 4.8 | 4.3 |
| 500 | 2.5 | 4.3 | 3.9 |
| 600 | 3.0 | 3.9 | 3.6 |
| 700 | 3.5 | 3.6 | 3.4 |
| 800 | 4.0 |
| Part No. | ATS-X50230G-C1-R0 |
| Manufacturer | ATS |
| Size | 655 Kbytes |
| Pages | 1 page |
| Description | High Performance BGA Cooling |
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