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ATS-X50230G-C1-R0 Datasheet with Chat AI
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  • # Example questions: ➢ How does the thermal resistance change as the air velocity increases from 200 ft/min to 800 ft/min?
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  • Part No.ATS-X50230G-C1-R0
    ManufacturerATS
    Size655 Kbytes
    Pages1 page
    DescriptionHigh Performance BGA Cooling
    Datasheet Summary with AI

    # High Performance BGA Cooling Solutions w/ superGRIP™ Attachment

    ## Product Details
    ️· ATS Part #: ATS-X50230G-C1-R0
    ️· Dimensions:
    - Length: 23 mm
    - Width: 23 mm
    - Height: 12.5 mm
    - Fin Tip to Fin Tip: 41.5 mm
    ️· Material: Chomerics T766
    ️· Finish: Blue-Anodized
    ️· Designed For: 23 x 23 mm BGA components

    ## Features & Benefits
    ️· Requires minimal space around the component, suitable for densely populated PCBs.
    ️· Allows heat sink detachment/reattachment without component/PCB damage.
    ️· Provides strong, uniform attachment force for optimal phase-changing TIM performance.
    ️· Eliminates the need for PCB mounting holes.
    ️· Includes a maxiFLOW™ heat sink for maximized convection cooling.
    ️· Uses a clean break, reworkable Chomerics T-766 phase change material.

    ## Thermal Performance
    ️· Air Velocity & Thermal Resistance:

    Air Velocity (FT/MIN) M/S Thermal Resistance (°C/W - Unducted Flow) Thermal Resistance (°C/W - Ducted Flow)
    200 1.0 6.7 5.4
    300 1.5 5.5 4.8
    400 2.0 4.8 4.3
    500 2.5 4.3 3.9
    600 3.0 3.9 3.6
    700 3.5 3.6 3.4
    800 4.0

    ## Notes
    ️· Length and width dimensions refer to component size.
    ️· Heat sink dimensions have tolerances of up to .99 mm.
    ️· Thermal performance data is for reference only.
    ️· ATS reserves the right to modify products.
    ️· Additional tooling fees may be required.
    ️· Typical lead time: 4-6 weeks.
    ️· Contact ATS for custom options.

    ## Contact Information
    ️· Website: www.qats.com
    ️· North America: 781.769.2800
    ️· Europe: +31 (0) 3569 84715

    # High Performance BGA Cooling Solutions w/ superGRIP™ Attachment

    ## Product Details
    ️· ATS Part #: ATS-X50230G-C1-R0
    ️· Dimensions:
    - Length: 23 mm
    - Width: 23 mm
    - Height: 12.5 mm
    - Fin Tip to Fin Tip: 41.5 mm
    ️· Material: Chomerics T766
    ️· Finish: Blue-Anodized
    ️· Designed For: 23 x 23 mm BGA components

    ## Features & Benefits
    ️· Requires minimal space around the component, suitable for densely populated PCBs.
    ️· Allows heat sink detachment/reattachment without component/PCB damage.
    ️· Provides strong, uniform attachment force for optimal phase-changing TIM performance.
    ️· Eliminates the need for PCB mounting holes.
    ️· Includes a maxiFLOW™ heat sink for maximized convection cooling.
    ️· Uses a clean break, reworkable Chomerics T-766 phase change material.

    ## Thermal Performance
    ️· Air Velocity & Thermal Resistance:

    Air Velocity (FT/MIN) M/S Thermal Resistance (°C/W - Unducted Flow) Thermal Resistance (°C/W - Ducted Flow)
    200 1.0 6.7 5.4
    300 1.5 5.5 4.8
    400 2.0 4.8 4.3
    500 2.5 4.3 3.9
    600 3.0 3.9 3.6
    700 3.5 3.6 3.4
    800 4.0

    ## Notes
    ️· Length and width dimensions refer to component size.
    ️· Heat sink dimensions have tolerances of up to .99 mm.
    ️· Thermal performance data is for reference only.
    ️· ATS reserves the right to modify products.
    ️· Additional tooling fees may be required.
    ️· Typical lead time: 4-6 weeks.
    ️· Contact ATS for custom options.

    ## Contact Information
    ️· Website: www.qats.com
    ️· North America: 781.769.2800
    ️· Europe: +31 (0) 3569 84715

    Part No.ATS-X50230G-C1-R0
    ManufacturerATS
    Size655 Kbytes
    Pages1 page
    DescriptionHigh Performance BGA Cooling
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