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Hello, Please ask a question about ATS-X50270G-C1-R0 Datasheet
# Example questions:
➢ How does the thermal resistance change when using ducted versus unducted airflow at a velocity of 500 ft/min?
➢ What are the dimensions of the heat sink, specifically the length, width, and height?
➢ What is the typical lead time for receiving this product after placing an order?
# High Performance BGA Cooling Solutions w/ superGRIP™ Attachment
## Product Details
️· ATS Part #: ATS-X50270G-C1-R0
️· Dimensions:
- Length: 27 mm
- Width: 27 mm
- Height: 12.5 mm
- Fin Tip to Fin Tip: 48.3 mm
️· Material: Chomerics T766
️· Finish: Blue-Anodized
️· Design: Designed for 27 x 27 mm BGA components
️· Notes:
- Dimensions are subject to tolerances of up to .99 mm.
- Thermal performance data is for reference only.
- ATS reserves the right to update product specifications.
- Lead time is typically 4-6 weeks.
## Features & Benefits
️· superGRIP™ Attachment: Allows detachment and reattachment without component or PCB damage.
️· Phase-Changing TIM: Comes standard with clean break, reworkable, Chomerics T-766 phase change material.
️· No Mounting Holes: Eliminates need to drill mounting holes in PCB.
️· maxiFLOW™ Heat Sink: Maximizes convection (air) cooling.
️· Strong & Uniform Attachment: Helps achieve maximum performance from phase-changing TIMs.
️· Space-Saving Design: Requires minimal space around component.
## Thermal Performance
️· Air Velocity & Thermal Resistance:
| Air Velocity (FT/MIN) | Air Velocity (M/S) | Thermal Resistance (Unducted Flow °C/W) | Thermal Resistance (Ducted Flow °C/W) |
|---|---|---|---|
| 200 | 1.0 | 4.8 | 1.0 |
| 300 | 1.5 | 3.9 | 1.5 |
| 400 | 2.0 | 3.4 | 2.0 |
| 500 | 2.5 | 3.0 | 2.5 |
| 600 | 3.0 | 2.8 | 2.6 |
| 700 | 3.5 | 2.4 | 2.8 |
| 800 | 4.0 | 3.8 |
# High Performance BGA Cooling Solutions w/ superGRIP™ Attachment
## Product Details
️· ATS Part #: ATS-X50270G-C1-R0
️· Dimensions:
- Length: 27 mm
- Width: 27 mm
- Height: 12.5 mm
- Fin Tip to Fin Tip: 48.3 mm
️· Material: Chomerics T766
️· Finish: Blue-Anodized
️· Design: Designed for 27 x 27 mm BGA components
️· Notes:
- Dimensions are subject to tolerances of up to .99 mm.
- Thermal performance data is for reference only.
- ATS reserves the right to update product specifications.
- Lead time is typically 4-6 weeks.
## Features & Benefits
️· superGRIP™ Attachment: Allows detachment and reattachment without component or PCB damage.
️· Phase-Changing TIM: Comes standard with clean break, reworkable, Chomerics T-766 phase change material.
️· No Mounting Holes: Eliminates need to drill mounting holes in PCB.
️· maxiFLOW™ Heat Sink: Maximizes convection (air) cooling.
️· Strong & Uniform Attachment: Helps achieve maximum performance from phase-changing TIMs.
️· Space-Saving Design: Requires minimal space around component.
## Thermal Performance
️· Air Velocity & Thermal Resistance:
| Air Velocity (FT/MIN) | Air Velocity (M/S) | Thermal Resistance (Unducted Flow °C/W) | Thermal Resistance (Ducted Flow °C/W) |
|---|---|---|---|
| 200 | 1.0 | 4.8 | 1.0 |
| 300 | 1.5 | 3.9 | 1.5 |
| 400 | 2.0 | 3.4 | 2.0 |
| 500 | 2.5 | 3.0 | 2.5 |
| 600 | 3.0 | 2.8 | 2.6 |
| 700 | 3.5 | 2.4 | 2.8 |
| 800 | 4.0 | 3.8 |
| Part No. | ATS-X50270G-C1-R0 |
| Manufacturer | ATS |
| Size | 656 Kbytes |
| Pages | 1 page |
| Description | High Performance BGA Cooling |
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