96 BALL FBGA PACKAGE Datasheet(PDF) - IC280-169-127

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96 BALL FBGA PACKAGE Datasheet, PDF

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Searched Keyword : '96 BALL FBGA PACKAGE ' - Total: 14 (1/1) Pages

Manufacturer	Part #	Datasheet	Description
Yamaichi Electronics Co...	IC280-169-127	263Kb/5P	Ball Grid Array (FBGA / CSP / LGA)
	NP291-03617	41Kb/1P	Fine Ball Grid Array (FBGA, 0.75mm Pitch)
	NP352-04808	563Kb/8P	Fine Ball Grid Array (FBGA, 1.00mm Pitch)
	NP276-11904	738Kb/11P	Ball Grid Array (BGA, 1.27mm Pitch)
	NP396-500	120Kb/1P	Shrink Ball Grid Array (1.27mm Pitch)
	IC264-22501-1	200Kb/1P	Ball Grid Array (BGA, 1.50mm Pitch)
	FNS12-06400-00BF	104Kb/4P	DIN41612 - IDC Type Socket, 64 96 Leads / 33MIL (0.847mm), Hitachi Cable (150V, 105째C)
	IC70-0726-G4	40Kb/1P	Single Inline Package (SIP)
	IC37NRB-1403-G4	39Kb/1P	Dual Inline Package (DIP)
	IC7612-2003-G4	127Kb/2P	Shrink Dual Inline Package (SDIP)
	IC39-1206-G4	38Kb/1P	Zig-Zag Inline Package (ZIP)
	IC182-4007-MF	95Kb/1P	Zig-Zag Inline Package (ZIP)
	NP284-26409N	82Kb/1P	Chip Scale Package (CSP, 0.50mm Pitch)
	NP383-18010-N	174Kb/1P	Chip Scale Package -TH (CSP, 0.50mm Pitch)

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