| Manufacturer | Part # | Datasheet | Description |
Molex Electronics Ltd.
|
0850030610 |
84Kb/3P |
2.54mm (.100") Pitch DIN 41612 Header, Style C, Right Angle, Through Hole, 1關m (40關") Selective Gold (Au), 64 Circuits, Lead free |
| 0877582650 |
147Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 26 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray Packaging, Lead-free |
| 0753417477 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0753417446 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0877582250 |
147Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 22 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray Packaging, Lead-free |
| 0877584850 |
147Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 48 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray Packaging, Lead-free |
| 0753414767 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0850131938 |
139Kb/5P |
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 0.6關m (24關) Selective Gold (Au), 64 Circuits, Lead free |
| 0850133160 |
135Kb/5P |
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1關m (40關) Selective Gold (Au), 32 Circuits, Lead free |
| 0753310444 |
339Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 3-Pair GbX짰 Backplane Connector System, Power Module, 6 Circuits,1.27關m (50關) Gold (Au) |
| 0753416767 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0755177777 |
345Kb/5P |
1.85mm by 1.85mm (.073 by .073) Pitch 5-Pair GbX짰 Backplane Connector System, Power Module, 10 Circuits, 1.27關m (50關) Gold (Au) |
| 0877580014 |
195Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 14 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray Packaging, Lead-free |
| 0753417647 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0877540552 |
194Kb/4P |
2.00mm (.079) Pitch Header, Breakaway, Right Angle, Through Hole, Vertical, 5 Circuits, 0.38關m (15關) Gold (Au) Plating, Tray Packaging, Lead-free |
| 0850030309 |
84Kb/3P |
2.54mm (.100") Pitch DIN 41612 Header, Style C, Right Angle, Through Hole, 0.6關m (24關") Selective Gold (Au), Board Lock , 64 Circuits |
| 0753417774 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073") Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關") Gold (Au) |
| 0753417646 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073") Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關") Gold (Au) |
| 0753414764 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073") Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關") Gold (Au) |
| 0781208013 |
499Kb/7P |
1.27mm (.050") Pitch Wire-to-Board Receptacle, Dual Row, Vertical, SMT, 0.25關m (10關") Gold (Au) Plating, without Kapton Tape, 80 Circuits |
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