| Manufacturer | Part # | Datasheet | Description |
Molex Electronics Ltd.
|
0791081014 |
304Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Flex-to-Board Vertical Receptacle Dual Row Through-Hole, 0.38關m (15關) Gold (Au) Selective Plating, 30 Circuits, Leadfree |
| 0791081004 |
304Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Flex-to-Board Vertical Receptacle Dual Row Through-Hole, 0.38關m (15關) Gold (Au) Selective Plating, 10 Circuits, Leadfree |
| 0753310533 |
341Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 3-Pair GbX짰 Backplane Connector System, Power Module, 6 Circuits, 1.27關m (50關) Gold (Au), Lead Free |
| 0873811217 |
126Kb/3P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.76關m (30關) Gold (Au) Plating, without Cap, with Locating Peg, 12 Circuits, Leadfree |
| 0791081015 |
304Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Flex-to-Board Vertical Receptacle Dual Row Through-Hole, 0.38關m (15關) Gold (Au) Selective Plating, 32 Circuits, Leadfree |
| 0850130218 |
93Kb/3P |
2.54mm (.100) Pitch DIN 41612 Header, Vertical, C-Pin Press-Fit Style R Reverse, 1關m (40關) Selective Gold (Au), 96 Circuits, Lead free |
| 0873819030 |
112Kb/3P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.76關m (30關) Gold (Au) Plating, with Cap Version, with Locating Pegs, 10 Circuits |
| 0791077014 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.38關m (15關) Gold (Au) Selective Plating, 30 Circuits |
| 0791081002 |
304Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Flex-to-Board Vertical Receptacle Dual Row Through-Hole, 0.38關m (15關) Gold (Au) Selective Plating, 6 Circuits, Leadfree |
| 0754650104 |
244Kb/3P |
1.85mm by 1.85mm (.073 by .073) Pitch 4 Pair GbX짰 Backplane L-Series Connector System, Open Header, 110 Circuits, Gold (Au) 0.76關m (30關) |
| 0873810618 |
124Kb/3P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.38關m (15關) Gold (Au) Plating, without Cap, with Locating Peg, 6 Circuits, Leadfree |
| 0873813618 |
126Kb/3P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.38關m (15關) Gold (Au) Plating, without Cap, with Locating Peg, 36 Circuits, Leadfree |
| 0791077219 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075) Tail Length, 0.38關m (15關) Gold (Au) Selective Plating, 40 Circuits |
| 0758340105 |
161Kb/3P |
1.85mm by 1.85mm (.073 by .073) Pitch 2-Pair GbX짰 Electrically Enhanced Backplane Connector System, Open Header, 100 Circuits, Gold (Au) 0.76關m(30關) |
| 0850131512 |
137Kb/5P |
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 0.6關m (24關) Selective Gold (Au), 96 Circuits, Flux Proof Option Available |
| 0785430151 |
763Kb/9P |
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Off-White Housing and Latches, 0.38關m (15關) Gold (Au) Plating |
| 0783960001 |
383Kb/6P |
0.80mm(.031), 1.27mm(.050) Micro SAS Receptacle, Vertical, SMT, 0.76關m(30關) Gold (Au) Plating, 25 Circuits, for 1.00mm (.039) PCB Thickness,Halogen free |
| 0791077268 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075") Tail Length, 0.76關m (30關") Gold (Au) Selective Plating, 38 Circuits |
| 0791077141 |
278Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.05關m (2關") Gold (Au) Selective Plating, 34 Circuits |
| 0791081072 |
304Kb/6P |
2.00mm (.079") Pitch Milli-Grid??Flex-to-Board Vertical Receptacle Dual Row Through- Hole, 0.76關m (30關") Gold (Au) Selective Plating, 46 Circuits, Leadfree |
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