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ADC32RF83 Datasheet(PDF) 135 Page - Texas Instruments |
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ADC32RF83 Datasheet(HTML) 135 Page - Texas Instruments |
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135 / 138 page  www.ti.com PACKAGE OUTLINE C PIN 1 ID 8.5 0.1 0.9 MAX 0.05 0.00 4X 8.5 72X 0.30 0.18 68X 0.5 72X 0.5 0.3 4X (45 X0.42) B 10.1 9.9 A 10.1 9.9 (0.2) 4221047/B 02/2014 VQFN - 0.9 mm max height RMP0072A VQFN NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. 54 37 36 19 18 1 72 55 0.1 C B A 0.05 C PIN 1 ID (R0.2) SYMM SYMM 0.08 C SEATING PLANE SCALE 1.700 |
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