STM32WLE4JC datasheet(134/146 Pages) STMICROELECTRONICS

Part #	STM32WLE4JC

Description	Multiprotocol LPWAN 32-bit Arm® Cortex®-M4 MCUs, LoRa®, (G)FSK, (G)MSK, BPSK, up to 256KB Flash, 64KB SRAM

PDF	146 Pages

Scroll/Zoom	100%

Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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134 / 146 page

Package information

STM32WLE5/E4xx

134/146

DS13105 Rev 9

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK packages, depending on their level of environmental compliance. ECOPACK

specifications, grade definitions and product status are available at www.st.com. ECOPACK

is an ST trademark.

6.1

UFQFPN48 package information

This UFQFPN is a 48 leads, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package.

Figure 30. UFQFPN48 - Outline

1. Drawing is not to scale.

2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.

3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and

solder this back-side pad to PCB ground.

A0B9_ME_V3

Pin 1 identifier

laser marking area

Exposed pad

area

Detail Z

R 0.125 typ.

C 0.500x45°

pin1 corner

Seating

plane

ddd

Detail Y

STM32WLE4JC Datasheet(PDF) 134 Page - STMicroelectronics