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STM32F412RGU3P Datasheet(PDF) 111 Page - STMicroelectronics

Part # STM32F412RGU3P
Description  Arm®-Cortex®-M4 32b MCUFPU, 125 DMIPS, 1MB Flash, 256KB RAM, USB OTG FS, 17 TIMs, 1 ADC, 17 comm. interfaces
PDF  201 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F412RGU3P Datasheet(HTML) 111 Page - STMicroelectronics

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DocID028087 Rev 7
111/201
STM32F412xE/G
Electrical characteristics
166
Note:
For information on selecting the crystal, refer to the application note AN2867 “Oscillator
design guide for ST microcontrollers” available from the ST website www.st.com.
For information about the LSE high-power mode, refer to the reference manual RM0383.
Figure 30. Typical application with a 32.768 kHz crystal
6.3.9
Internal clock source characteristics
The parameters given in Table 43 and Table 44 are derived from tests performed under
ambient temperature and VDD supply voltage conditions summarized in Table 16.
High-speed internal (HSI) RC oscillator
L
2. This parameter depends on the crystal used in the application. Refer to the application note AN2867.
3. tSU(LSE) is the startup time measured from the moment it is enabled (by software) to a stabilized
32.768 kHz oscillation is reached. This value is guaranteed by characterization and not tested in
production. It is measured for a standard crystal resonator and it can vary significantly with the crystal
manufacturer.
Table 43. HSI oscillator characteristics (1)
Symbol
Parameter
Conditions
Min
Typ Max Unit
fHSI
Frequency
-
-
16
-
MHz
ACCHSI
Accuracy of the HSI
oscillator
HSI user trimming step(2)
--
1
%
Factory-calibrated
TA = -40 to 125 °C(3)
-8
-
5.5
%
TA = -40 to 105 °C(3)
-8
-
4.5
%
TA = -10 to 85 °C(3)
-4
-
4
%
TA = 25 °C(4)
-1
-
1
%
tsu(HSI)(2) HSI oscillator startup time
-
-
2.2
4
µs
IDD(HSI)(2)
HSI oscillator power
consumption
-
-
60
80
µA
1. VDD = 3.3 V, TA = -40 to 125 °C unless otherwise specified.
2. Guaranteed by design, not tested in production
3. Based on characterization, not tested in production
4. Factory calibrated, parts not soldered.



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