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STM32F412RGU3P Datasheet(PDF) 170 Page - STMicroelectronics |
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STM32F412RGU3P Datasheet(HTML) 170 Page - STMicroelectronics |
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170 / 201 page  Package information STM32F412xE/G 170/201 DocID028087 Rev 7 7.2 UFQFPN48 package information Figure 63. UFQFPN48 - 48-lead, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this back-side pad to PCB ground. Table 101. UFQFPN48 - 48-lead, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package mechanical data Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. A 0.500 0.550 0.600 0.0197 0.0217 0.0236 A1 0.000 0.020 0.050 0.0000 0.0008 0.0020 D 6.900 7.000 7.100 0.2717 0.2756 0.2795 E 6.900 7.000 7.100 0.2717 0.2756 0.2795 D2 5.500 5.600 5.700 0.2165 0.2205 0.2244 |
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