STM32F412RGT3 datasheet(166/201 Pages) STMICROELECTRONICS

166 / 201 page

Electrical characteristics

STM32F412xE/G

166/201

DocID028087 Rev 7

6.3.27

RTC characteristics

CMD, D inputs (referenced to CK) in SD default mode

tISUD

Input setup time SD

fpp =25MHz

2.5

tIHD

Input hold time SD

fpp =25MHz

2.5

CMD, D outputs (referenced to CK) in SD default mode

tOVD

Output valid default time SD

fpp =25 MHz

-1.5

tOHD

Output hold default time SD

fpp =25 MHz

0.5

1. Guaranteed by characterization results, not tested in production.

2. VDD = 2.7 to 3.6 V.

Table 96. Dynamic characteristics: SD / MMC characteristics(1)(2) (continued)

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Table 97. Dynamic characteristics: eMMC characteristics VDD = 1.7 V to 1.9 V(1)(2)

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

fPP

Clock frequency in data transfer mode

MHz

SDIO_CK/fPCLK2 frequency ratio

8/3

tW(CKL)

Clock low time

fpp =50MHz

9.5

10.5

tW(CKH)

Clock high time

fpp =50MHz

8.5

9.5

CMD, D inputs (referenced to CK) in eMMC mode

tISU

Input setup time HS

fpp =50MHz

3.5

tIH

Input hold time HS

fpp =50MHz

CMD, D outputs (referenced to CK) in eMMC mode

tOV

Output valid time HS

fpp =50MHz

13.5

tOH

Output hold time HS

fpp =50MHz

1. Guaranteed by characterization results, not tested in production.

2. CLOAD = 20 pF.

Table 98. RTC characteristics

Symbol

Parameter

Conditions

Min

Max

-fPCLK1/RTCCLK frequency ratio

Any read/write operation

from/to an RTC register

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