2-WAY POWER DIVIDERS

PDD-3X-1.5G

Merrimac Industries / 41 Fairfield Place, West Caldwell, NJ 07006

Tel: 1.888.434.6636 / Fax: 973.882.5990 / Email: pico@merrimacind.com / www.Multi-Mix.com

TECHNICAL DESCRIPTION / APPLICATION

MULTI-MIX PICO™ X-SERIES POWER DIVIDERS

The Multi-Mix® PDD-X series provides an in-phase, binary power divider with low insertion loss in a

small outline. Accurate phase and amplitude balance make them ideal for applications involving IQ net-

works, power amplifiers, signal distribution and processing.

PDD-X power dividers are fusion bonded multilayer stripline assemblies. The fusion bonding process

yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical perform-

ance that is superior to conventional adhesive bonding techniques.

The PDD-X series is an easy to install SMD designed specifically for the full spectrum of wireless appli-

cations. The high stability ceramic filled PTFE dielectrics utilized in these components are compatible

with common substrates such as FR-4, G-10, and polyamide. The wrap around ground plane provides

excellent EM shielding.

Additional benefits include:

Available on tape and reel

Cost effective for commercial wireless applications

Small outline size

Operating temperature range –55°C to +85°C.

Can be integrated with other Multi-Mix® components in a multi-function module

RELIABILITY

The product family has passed environmental screening including Thermal shock, Burn-in, Acceleration,

Vibration, Mechanical Shock, Moisture Resistance, Resistance to Solder Heat, and Thermal Cycling Life

Test (>1000 cycles).

THE MULTI-MIX® PROCESS

Multi-Mix® is a manufacturing process based on fluoropolymer composite substrates that are fusion

bonded together into a multilayer structure. The fusion bonding process yields a homogeneous mono-

lithic structure with superior performance at microwave and millimeter wave frequencies. The bonded

layers can contain embedded semiconductors, MMICs, etched resistors, circuit patterns, and plated-

through vias to form a SMD module that requires no additional packaging and is suitable for automated

assembly.

• 1.3 - 1.7 GHz

• LOW LOSS

• HIGH ISOLATION

• SURFACE MOUNT

• TAPE & REEL

REV: 002, 06/27/02

AVAILABLE ON

TAPE & REEL

THE MULTI-MIX MICROTECHNOLOGY

U.S. patent 6,099,677 and other patents pending.