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STM32F103xC Datasheet(PDF) 112 Page - STMicroelectronics |
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STM32F103xC Datasheet(HTML) 112 Page - STMicroelectronics |
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112 / 130 page ![]() Package characteristics STM32F103xC, STM32F103xD, STM32F103xE 112/130 Doc ID 14611 Rev 8 Figure 62. BGA pad footprint Table 65. Recommended PCB design rules (0.80/0.75 mm pitch BGA) Dimension Recommended values Dpad ∅ = 0.37 mm Dsm ∅ = 0.52 mm typ. (depends on solder mask registration tolerance) Solder paste 0.37 mm aperture diameter – Non solder mask defined pads are recommended – 4 to 6 mils screen print |
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