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STM8S103F2 Datasheet(PDF) 104 Page - STMicroelectronics

Part # STM8S103F2
Description  Access line, 16 MHz STM8S 8-bit MCU, up to 8 Kbytes Flash, data EEPROM,10-bit ADC, 3 timers, UART, SPI, I²C
PDF  117 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM8S103F2 Datasheet(HTML) 104 Page - STMicroelectronics

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Thermal characteristics
12
The maximum chip junction temperature (TJ max) must never exceed the values given in
Operating conditions.
The maximum chip-junction temperature, TJmax, in degrees Celsius, may be calculated using
the following equation:
TJmax = TAmax + (PDmax x ΘJA)
Where:
• TAmax is the maximum ambient temperature in °C
• ΘJA is the package junction-to-ambient thermal resistance in °C/W
• PDmax is the sum of PINTmax and PI/Omax(PDmax = PINTmax + PI/Omax)
• PINTmax is the product of IDDandVDD, expressed in Watts. This is the maximum chip internal
power.
• PI/Omax represents the maximum power dissipation on output pins
Where: PI/Omax =Σ (VOL*IOL) + Σ((VDD-VOH)*IOH), taking into account the actual VOL/IOL and
VOH/IOH of the I/Os at low and high level in the application.
Table 58: Thermal characteristics
Unit
Value
Parameter
(1)
Symbol
°C/W
84
Thermal resistance junction-ambient
TSSOP20 - 4.4 mm
ΘJA
91
Thermal resistance junction-ambient
SO20W (300 mils)
ΘJA
90
Thermal resistance junction-ambient
UFQFPN20 - 3 x 3 mm
ΘJA
60
Thermal resistance junction-ambient
LQFP32 - 7 x 7 mm
ΘJA
38
Thermal resistance junction-ambient
UFQFPN32 - 5 x 5 mm
ΘJA
60
Thermal resistance junction-ambient
SDIP32 - 400 mils
ΘJA
(1)Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural
convection environment.
DocID15441 Rev 9
104/117
STM8S103K3 STM8S103F3 STM8S103F2
Thermal characteristics



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