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STM32F413CG Datasheet(PDF) 175 Page - STMicroelectronics |
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STM32F413CG Datasheet(HTML) 175 Page - STMicroelectronics |
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175 / 207 page ![]() DocID029162 Rev 2 175/207 STM32F413xG/H Package information 205 7 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 7.1 WLCSP81 package information Figure 63. WLCSP81 - 81-ball, 4.039 x 3.951 mm, 0.4 mm pitch wafer level chip scale package outline 1. Drawing is not to scale. |
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