The part number **2118059-2** refers to a high-performance **Standard Surface Mount (SMT) EMI Shield** (specifically a shield frame) manufactured by **TE Connectivity**. These components are critical in modern electronics to prevent Electromagnetic Interference (EMI) from affecting sensitive circuits. --- ### 1. Technical Specifications The following table summarizes the key physical and electrical characteristics of the 2118059-2: | Feature | Specification | | :--- | :--- | | **Manufacturer** | TE Connectivity | | **Product Type** | EMI Shield (Frame) | | **Shield Type** | Two-Piece (Frame only) | | **Material** | Cold Rolled Steel (CRS) | | **Plating** | Tin (Sn) | | **Mounting Style** | Surface Mount (SMT) | | **Dimensions (L x W)** | 44.37 mm x 44.37 mm | | **Height** | 9.75 mm | --- ### 2. Functional Description The 2118059-2 is the **frame** portion of a two-piece shielding system. In a typical application: * **The Frame:** Is soldered directly onto the Printed Circuit Board (PCB) during the SMT reflow process. * **The Cover:** A matching metal lid (sold separately) snaps onto this frame. This two-piece design allows technicians to remove the cover for inspection, testing, or repair of the components underneath without having to desolder the shield from the board. --- ### 3. Key Applications This specific part is used in environments where radio frequency (RF) signals or electromagnetic noise could degrade performance: * **Telecommunications:** Base stations, routers, and high-speed switches. * **Industrial Controls:** Protecting microprocessors from motor noise or power supply interference. * **Computing:** High-speed data processing units and servers. * **Consumer Electronics:** Devices requiring high-density PCB layouts where components are packed closely together. --- ### 4. Installation and Assembly To ensure proper performance, the following guidelines are usually followed: 1. **Solder Paste:** Applied to the PCB pads corresponding to the frame's perimeter. 2. **Reflow:** The frame is passed through a standard SMT reflow oven. 3. **Cover Attachment:** After the board is populated and tested, the compatible cover is pressed onto the frame, where it is held by mechanical friction/clips.