The **ATS-01G-110-C2-R1** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** designed by Advanced Thermal Solutions (ATS). It is engineered for cooling electronic components such as CPUs, GPUs, or high-power ASICs on a Printed Circuit Board (PCB). --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Specification | Details | | :--- | :--- | | **Component Type** | Heat Sink | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 35mm x 35mm x 25mm | | **Attachment Method** | Push-Pin (Plastic) with Compression Spring | | **Fin Style** | Straight Fin | | **Thermal Resistance** | ~4.40 °C/W (at 200 LFM) | | **Interface Material** | T766 (Pre-applied Phase Change Material) | --- ### 2. Design and Functional Features #### A. Heat Sink Geometry * **Base Dimensions:** The 35mm footprint is standard for many mid-sized integrated circuits. * **Fin Profile:** The vertical straight fins allow for efficient airflow (convection) to carry heat away from the base. * **Material:** Aluminum is used for its high thermal conductivity and lightweight properties, while the **Blue Anodized** finish provides surface protection and improved emissivity. #### B. Mounting Mechanism (Push-Pin) This part utilizes a **Push-Pin and Spring** system: * **Pins:** Designed to snap into pre-drilled holes on the PCB. * **Springs:** Provide a consistent downward force (pressure) to ensure maximum contact between the heat sink and the chip, which minimizes thermal resistance. #### C. Thermal Interface Material (TIM) The **C2** designation indicates that it comes with **T766** pre-applied. * This is a "Phase Change" material that softens at operating temperatures to fill microscopic air gaps between the chip and the metal, significantly improving heat transfer. --- ### 3. Usage Context This component is typically found in: * **Telecommunications:** Cooling networking switches or routers. * **Embedded Systems:** Industrial PCs where fan-forced air is present. * **Power Supplies:** Regulating temperature for voltage modules. --- ### 4. CAD and Footprint Data If you are designing a PCB for this part, the hole pattern is critical: ```markdown Hole Diameter: 3.0mm Hole Pitch: 40.5mm (Center-to-Center) ```