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  • ATS-03F-103-C2-R1

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    The **ATS-03F-103-C2-R1** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or damage. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific model: | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 30.00mm | | **Attachment Method** | pushPIN™ (Plastic Pins & Springs) | | **Thermal Resistance** | 2.76°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Features and Components ### A. Fin Design (Cross-Cut) The "103" in the part number refers to a specific fin configuration. This model features a **Fine-Pitch** or **Cross-Cut** pattern. Unlike straight fins, cross-cut fins allow for multi-directional airflow, making it ideal for systems where the air direction might change or is turbulent. ### B. pushPIN™ Attachment System This part uses a specialized mounting mechanism rather than adhesive tape or screws: * **Plastic Push Pins:** These snap into pre-drilled holes on the PCB. * **Compression Springs:** These provide a precise "force" to ensure the heat sink makes firm, consistent contact with the electronic chip. ### C. Thermal Interface Material (TIM) The unit comes with **T766** material pre-applied to the base. This fills the microscopic air gaps between the chip surface and the aluminum base, significantly improving heat transfer efficiency. --- ## 3. Part Number Breakdown The nomenclature follows a specific logic: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **03** | Series/Mounting Type | | **F** | Fin style/material indicator | | **103** | Specific dimensions/fin density code | | **C2** | Blue Anodized finish | | **R1** | Revision or Packaging code | --- ## 4. Typical Applications * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** High-speed routers and switches. * **Power Electronics:** Voltage regulators and power modules.
    ✨ Follow-up Questions
    • What are the PCB hole requirements for the pushPIN mounting system?
    • How does the T766 thermal material compare to standard thermal grease?
    • Can this heat sink be used with active cooling fans?