ATS-03F-103-C2-R1
AI

The **ATS-03F-103-C2-R1** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or damage.
---
## 1. Technical Specifications
Below are the primary physical and thermal characteristics of this specific model:
| Attribute | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Series** | pushPIN™ |
| **Base Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 30.00mm |
| **Attachment Method** | pushPIN™ (Plastic Pins & Springs) |
| **Thermal Resistance** | 2.76°C/W (at 100 LFM) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
---
## 2. Key Features and Components
### A. Fin Design (Cross-Cut)
The "103" in the part number refers to a specific fin configuration. This model features a **Fine-Pitch** or **Cross-Cut** pattern. Unlike straight fins, cross-cut fins allow for multi-directional airflow, making it ideal for systems where the air direction might change or is turbulent.
### B. pushPIN™ Attachment System
This part uses a specialized mounting mechanism rather than adhesive tape or screws:
* **Plastic Push Pins:** These snap into pre-drilled holes on the PCB.
* **Compression Springs:** These provide a precise "force" to ensure the heat sink makes firm, consistent contact with the electronic chip.
### C. Thermal Interface Material (TIM)
The unit comes with **T766** material pre-applied to the base. This fills the microscopic air gaps between the chip surface and the aluminum base, significantly improving heat transfer efficiency.
---
## 3. Part Number Breakdown
The nomenclature follows a specific logic:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **03** | Series/Mounting Type |
| **F** | Fin style/material indicator |
| **103** | Specific dimensions/fin density code |
| **C2** | Blue Anodized finish |
| **R1** | Revision or Packaging code |
---
## 4. Typical Applications
* **Embedded Systems:** Industrial PCs and controllers.
* **Telecommunications:** High-speed routers and switches.
* **Power Electronics:** Voltage regulators and power modules.
- ⤷
What are the PCB hole requirements for the pushPIN mounting system?
- ⤷ How does the T766 thermal material compare to standard thermal grease?
- ⤷ Can this heat sink be used with active cooling fans?