The **ATS-03F-107-C2-R1** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed specifically for cooling electronic components such as CPUs, GPUs, and power transistors. ### 1. Key Technical Specifications The following table summarizes the primary physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Shape** | Rectangular, Fin-style | | **Length/Width** | 50mm x 50mm | | **Height** | 12.7mm | | **Thermal Resistance** | 2.79°C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | --- ### 2. Electronic/Thermal Performance Electronic components generate heat during operation. The ATS-03F-107-C2-R1 functions by increasing the surface area of the component to dissipate that heat into the surrounding air. * **Thermal Management:** The "C2" in the part number indicates a specific thermal interface material (TIM) or finish requirement, often optimized for medium-to-high heat loads. * **Airflow Efficiency:** The fin design is optimized for **forced convection** (using a fan). If there is no airflow, the thermal resistance increases significantly, which could lead to component failure. * **Pressure & Contact:** The pushPIN™ mechanism ensures even pressure across the electronic chip, which is critical for minimizing the "air gap" between the chip and the heat sink. --- ### 3. Structural Features The part belongs to the **pushPIN™** family, which is popular in industrial electronics for the following reasons: 1. **Vibration Resistance:** The spring-loaded pins prevent the heat sink from shifting or falling off during transport or operation. 2. **Ease of Assembly:** It uses pre-drilled holes in the PCB, allowing for quick installation without messy adhesives. 3. **Low Profile:** At 12.7mm tall, it is suitable for 1U server racks or compact electronic enclosures where vertical space is limited. ---