ATS-04F-104-C2-R1
AI

The **ATS-04F-104-C2-R1** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed specifically for cooling electronic components like processors, FPGAs, and ASICs.
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### 1. Technical Specifications
The following table highlights the critical mechanical and thermal properties of this part:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum (Blue Anodized) |
| **Thermal Resistance** | 2.52°C/W (at 200 LFM) |
| **Attachment Method** | pushPIN™ |
| **Dimensions (L x W)** | 40mm x 40mm |
| **Height** | 25mm |
| **Fin Style** | maxiFLOW (Tapered Fin Design) |
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### 2. Key Component Features
#### A. maxiFLOW™ Design
The "maxiFLOW" geometry features a spread-fin design. Unlike standard rectangular heat sinks, these fins taper outwards. This increases the surface area and creates better airflow intake, which is essential for components in high-density PCB environments.
#### B. pushPIN™ Attachment
The part uses a **pushPIN™** mounting system. This is a mechanical attachment method that:
* Ensures consistent pressure (load) on the component for maximum heat transfer.
* Includes a compression spring to prevent damage to the chip during installation or vibration.
* Is available in various heights and spring forces.
#### C. C2 Material/Finish
The "C2" suffix typically denotes the **Blue Anodized** finish. This is not just for aesthetics; anodizing increases the emissivity of the aluminum, slightly improving radiative cooling, and provides a protective layer against corrosion.
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### 3. Applications
This specific heat sink is commonly used in the following electronic systems:
1. **Networking Hardware:** Routers and switches where high-speed chips generate significant heat.
2. **Embedded Systems:** Industrial PCs where space is limited but cooling is critical.
3. **Power Supplies:** Cooling MOSFETs or power regulators.
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### 4. Thermal Performance Comparison
*Performance varies based on airflow (LFM - Linear Feet per Minute):*
```python
# Approximate Thermal Resistance (Lower is better)
performance_data = {
"100_LFM": "3.87 °C/W",
"200_LFM": "2.52 °C/W",
"300_LFM": "2.02 °C/W",
"400_LFM": "1.77 °C/W"
}
```
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- ⤷
What is the hole pattern requirement for the pushPIN mounting on this model?
- ⤷ How does the 'R1' suffix at the end of the part number affect its RoHS compliance or packaging?
- ⤷ Can this heat sink be used with a Phase Change Material (PCM) interface instead of standard thermal paste?