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  • ATS-04F-104-C2-R1

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    The **ATS-04F-104-C2-R1** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed specifically for cooling electronic components like processors, FPGAs, and ASICs. --- ### 1. Technical Specifications The following table highlights the critical mechanical and thermal properties of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 2.52°C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W)** | 40mm x 40mm | | **Height** | 25mm | | **Fin Style** | maxiFLOW (Tapered Fin Design) | --- ### 2. Key Component Features #### A. maxiFLOW™ Design The "maxiFLOW" geometry features a spread-fin design. Unlike standard rectangular heat sinks, these fins taper outwards. This increases the surface area and creates better airflow intake, which is essential for components in high-density PCB environments. #### B. pushPIN™ Attachment The part uses a **pushPIN™** mounting system. This is a mechanical attachment method that: * Ensures consistent pressure (load) on the component for maximum heat transfer. * Includes a compression spring to prevent damage to the chip during installation or vibration. * Is available in various heights and spring forces. #### C. C2 Material/Finish The "C2" suffix typically denotes the **Blue Anodized** finish. This is not just for aesthetics; anodizing increases the emissivity of the aluminum, slightly improving radiative cooling, and provides a protective layer against corrosion. --- ### 3. Applications This specific heat sink is commonly used in the following electronic systems: 1. **Networking Hardware:** Routers and switches where high-speed chips generate significant heat. 2. **Embedded Systems:** Industrial PCs where space is limited but cooling is critical. 3. **Power Supplies:** Cooling MOSFETs or power regulators. --- ### 4. Thermal Performance Comparison *Performance varies based on airflow (LFM - Linear Feet per Minute):* ```python # Approximate Thermal Resistance (Lower is better) performance_data = { "100_LFM": "3.87 °C/W", "200_LFM": "2.52 °C/W", "300_LFM": "2.02 °C/W", "400_LFM": "1.77 °C/W" } ``` ---
    ✨ Follow-up Questions
    • What is the hole pattern requirement for the pushPIN mounting on this model?
    • How does the 'R1' suffix at the end of the part number affect its RoHS compliance or packaging?
    • Can this heat sink be used with a Phase Change Material (PCM) interface instead of standard thermal paste?