The **ATS-05D-104-C2-R1** is a high-performance **Heat Sink** assembly from Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** family, designed for efficient thermal management on Printed Circuit Boards (PCBs). ### 1. Technical Specifications The part is defined by its dimensions, material properties, and attachment mechanism. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 25.00mm | | **Fin Style** | Board-Level, Cross-Cut (Pin Fin) | | **Thermal Resistance** | 2.52 °C/W (@ 1.0 m/s airflow) | | **Attachment Type** | pushPIN™ (Spring-loaded) | --- ### 2. Key Electronic & Mechanical Components #### A. Thermal Interface Material (TIM) The "C2" suffix in the part number indicates that this unit comes pre-applied with **T766 Phase Change Material**. This is a non-silicone thermal interface that fills microscopic air gaps between the heat-generating component (CPU/GPU/ASIC) and the aluminum base to maximize heat transfer. #### B. The pushPIN™ Mechanism This electronic cooling part uses a specialized attachment system consisting of: * **Brass Push Pins:** These snap into holes on the PCB. * **Stainless Steel Springs:** These provide a calculated, consistent pressure (preload) against the electronic component, ensuring thermal contact without damaging the solder joints. #### C. Fin Geometry The **Cross-Cut** design allows for multi-directional airflow. This is critical in electronic enclosures where the direction of the cooling fan's exhaust might not be perfectly aligned with the heat sink. --- ### 3. Application Use Cases This part is typically used to cool small, high-heat density components such as: * **Microprocessors (CPUs)** * **Field Programmable Gate Arrays (FPGAs)** * **Power Converters** * **High-speed Networking Chips** --- ### 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS-05** | Series (pushPIN™ Thermal Management) | | **D** | Attachment Type (Specific Push Pin/Spring combo) | | **104** | Dimensions and Fin Configuration | | **C2** | Thermal Interface Material (T766) | | **R1** | Revision/Standard Packaging |