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  • ATS-06H-100-C2-R0

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    The **ATS-06H-100-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed specifically for thermal management of electronic components like CPUs, GPUs, and other high-heat surface-mount devices. --- ### 1. Key Technical Specifications Below are the primary physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Dimensions** | 45mm x 45mm x 25mm | | **Material** | Aluminum | | **Fin Type** | Fine Pitch (Cross-cut) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 1.10°C/W (at 200 LFM) | | **Finish** | Blue Anodized | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Design and Component Breakdown #### A. The Fin Geometry (Cross-Cut) The "06H" designation refers to the specific fin pattern. This heat sink uses a **cross-cut** design, which creates many small pins. This increases the surface area significantly compared to standard straight fins, allowing for better heat dissipation in forced convection (fan-cooled) environments. #### B. The pushPIN™ Attachment System Instead of using messy adhesives or simple clips, this model uses a mechanical push-pin system. * **Springs:** Provides consistent pressure (load) on the electronic component to ensure a tight thermal bond. * **Pins:** Usually made of brass or plastic, designed to lock into pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **T766**. This is a thermal grease/pad layer on the base of the heat sink. It fills microscopic air gaps between the heat sink and the electronic chip, ensuring efficient heat transfer. --- ### 3. Understanding the Part Number (Nomenclature) | Code Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **06** | Fin pattern/Series type | | **H** | High-performance material/design | | **100** | Height/Size variation | | **C2** | Thermal Interface Material (T766) and color | | **R0** | RoHS compliant version | --- ### 4. Application Use-Cases * **Embedded Systems:** For cooling SoCs in industrial computers. * **Networking:** Used on high-speed switches and routers. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.
    ✨ Follow-up Questions
    • What are the PCB hole requirements for the pushPIN attachment?
    • How does the air flow rate (LFM) affect the thermal resistance of this heat sink?
    • Can the T766 thermal interface material be replaced with a different compound?