ATS-06H-100-C2-R0
AI

The **ATS-06H-100-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed specifically for thermal management of electronic components like CPUs, GPUs, and other high-heat surface-mount devices.
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### 1. Key Technical Specifications
Below are the primary physical and thermal characteristics of this specific part number:
| Feature | Specification |
| :--- | :--- |
| **Dimensions** | 45mm x 45mm x 25mm |
| **Material** | Aluminum |
| **Fin Type** | Fine Pitch (Cross-cut) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 1.10°C/W (at 200 LFM) |
| **Finish** | Blue Anodized |
| **Thermal Interface Material** | T766 (Pre-applied) |
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### 2. Design and Component Breakdown
#### A. The Fin Geometry (Cross-Cut)
The "06H" designation refers to the specific fin pattern. This heat sink uses a **cross-cut** design, which creates many small pins. This increases the surface area significantly compared to standard straight fins, allowing for better heat dissipation in forced convection (fan-cooled) environments.
#### B. The pushPIN™ Attachment System
Instead of using messy adhesives or simple clips, this model uses a mechanical push-pin system.
* **Springs:** Provides consistent pressure (load) on the electronic component to ensure a tight thermal bond.
* **Pins:** Usually made of brass or plastic, designed to lock into pre-drilled holes in the PCB.
#### C. Thermal Interface Material (TIM)
The part comes pre-applied with **T766**. This is a thermal grease/pad layer on the base of the heat sink. It fills microscopic air gaps between the heat sink and the electronic chip, ensuring efficient heat transfer.
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### 3. Understanding the Part Number (Nomenclature)
| Code Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer: Advanced Thermal Solutions |
| **06** | Fin pattern/Series type |
| **H** | High-performance material/design |
| **100** | Height/Size variation |
| **C2** | Thermal Interface Material (T766) and color |
| **R0** | RoHS compliant version |
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### 4. Application Use-Cases
* **Embedded Systems:** For cooling SoCs in industrial computers.
* **Networking:** Used on high-speed switches and routers.
* **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.
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What are the PCB hole requirements for the pushPIN attachment?
- ⤷ How does the air flow rate (LFM) affect the thermal resistance of this heat sink?
- ⤷ Can the T766 thermal interface material be replaced with a different compound?