The **ATS-07A-116-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**. It is manufactured by *Advanced Thermal Solutions (ATS)* and belongs to their "push-pin" attachment series. --- ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-07A-116-C2-R0 | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm | | **Fin Style** | XCUT (Cross-cut) | | **Thermal Resistance** | 4.14°C/W (at 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Design and Engineering Features #### **A. Fin Geometry (XCUT)** The "XCUT" design features a cross-cut pattern. Unlike straight fins, these provide multi-directional airflow capabilities. This is critical in dense electronic enclosures where the direction of the cooling fan's exhaust might not be perfectly aligned with the heat sink. #### **B. Attachment Mechanism (Push-Pin)** The part uses a **plastic push-pin** and a **compression spring**. * **Assembly:** It requires pre-drilled holes in the PCB. * **Security:** The spring provides precise pressure (clamping force) to ensure maximum contact between the heat sink and the component (usually a BGA or CPU). #### **C. Thermal Interface Material (TIM)** The **T766** material is pre-applied to the base of the heat sink. This is a high-performance thermal pad/paste that fills microscopic air gaps between the heat sink and the heat-generating component to improve thermal conductivity. --- ### 3. Application Use Cases This specific model is commonly used for cooling high-heat-density components such as: * **Processors (CPUs/GPUs):** Small form factor computing. * **FPGAs:** Field Programmable Gate Arrays in telecommunications. * **ASICs:** Application-Specific Integrated Circuits. * **Power Supplies:** Heat dissipation for MOSFETs or power regulators. ---