The **ATS-07D-116-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** from the advanced Thermal Solutions (ATS) push-pin series. It is designed to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 4.26°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 35mm | | **Fin Style** | Straight Fin | --- ### 2. Electronic & Mechanical Features #### A. Thermal Performance The primary purpose of this part is to reduce the junction temperature of a semiconductor. With a thermal resistance of **4.26°C/W** (under airflow), it efficiently transfers heat from the component surface to the surrounding air. The 35mm height provides a large surface area for convection. #### B. Push-Pin Attachment System Unlike adhesive-based heat sinks, the `ATS-07D-116-C3-R0` uses a mechanical push-pin system: * **Reliability:** Provides consistent pressure (clamping force) for optimal thermal interface material (TIM) performance. * **Durability:** It is resistant to shock and vibration, making it suitable for industrial or automotive electronics. * **Ease of Install:** Requires pre-drilled holes in the PCB (typically 3mm diameter). #### C. Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodization:** Not just for aesthetics; the anodized layer increases emissivity (radiant heat transfer) and provides electrical insulation and corrosion resistance. --- ### 3. Usage Example (Conceptual) When integrating this into a circuit design, the thermal engineer must ensure the PCB layout includes the specific hole pattern for the push-pins. ```python # Conceptual Calculation: Max Power Dissipation # Formula: Max_Power = (T_junction_max - T_ambient) / Total_Thermal_Resistance t_junction_max = 105 # Celsius t_ambient = 40 # Celsius thermal_res = 4.26 # C/W max_wattage = (t_junction_max - t_ambient) / thermal_res print(f"The maximum allowable power is {max_wattage:.2f} Watts") # Output: ~15.26 Watts ``` --- ### 4. Component Pros and Cons * **Pros:** High vertical clearance for maximum cooling, secure mechanical mounting, and RoHS compliant. * **Cons:** High profile (35mm) may not fit in 1U rack servers or slim mobile devices; requires physical PCB space for mounting holes.