ATS-08A-115-C2-R0
AI

The **ATS-08A-115-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide efficient cooling for electronic components like CPUs, GPUs, and other high-heat surface-mount devices.
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### 1. Technical Specifications
The following table highlights the core physical and thermal characteristics of this specific part number:
| Characteristic | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 5.33 °C/W (at 100 LFM) |
| **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm |
| **Pitch** | 1.14mm (High Performance) |
| **Bore/Hole Pattern** | Square (33.00mm x 33.00mm) |
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### 2. Component Breakdown
The assembly is composed of four primary electronic/mechanical parts:
1. **The Heat Sink (Extrusion):**
* Designed with a **straight-fin** or **cross-cut** geometry to maximize surface area.
* Made from **AL6063**, which offers high thermal conductivity for heat dissipation away from the semiconductor.
2. **The pushPIN™ Mechanism:**
* Uses a flexible, spring-loaded pin system.
* Unlike adhesive tapes, this provides constant **interface pressure**, ensuring better thermal contact between the chip and the sink.
3. **The Compression Spring:**
* Usually made from brass or stainless steel.
* Calculated to provide a specific "Force" (measured in Grams/mm) to prevent the heat sink from shifting during vibration or shipping.
4. **Thermal Interface Material (TIM):**
* The "C2" in the part number indicates it comes pre-applied with **T766 thermal phase change material** or a high-performance grease.
* This fills microscopic air gaps between the component and the heat sink.
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### 3. Thermal Performance Data
Performance varies based on the airflow (measured in Linear Feet per Minute - LFM) within the electronic enclosure:
| Airflow Velocity | 1.0 m/s (200 LFM) | 2.0 m/s (400 LFM) | 3.0 m/s (600 LFM) |
| :--- | :--- | :--- | :--- |
| **Thermal Resistance (Unducted)** | 2.97 °C/W | 1.90 °C/W | 1.54 °C/W |
| **Thermal Resistance (Ducted)** | 1.71 °C/W | 1.29 °C/W | 1.11 °C/W |
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### 4. Part Number Decoder
The part number **ATS-08A-115-C2-R0** can be broken down as follows:
* **ATS:** Advanced Thermal Solutions (Manufacturer).
* **08:** Heat Sink Series.
* **A:** Aluminum Material.
* **115:** Dimensional sequence/designation.
* **C2:** Thermal Interface Material (T766 / Blue Anodized finish).
* **R0:** Revision/Standard packaging.
- ⤷What is the difference between ducted and unducted thermal resistance?
- ⤷ How do I calculate the correct spring force for my PCB?
- ⤷ Are there alternative attachment methods to the pushPIN system?