The **ATS-08F-114-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or power transistors. --- ### 1. Key Technical Specifications | Feature | Specification | |:---|:---| | **Part Number** | ATS-08F-114-C3-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 15.00mm | | **Fin Style** | High-performance Fine Pitch | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Breakdown of the Component Parts #### A. The Heat Sink Body (Aluminum) The body is extruded from aluminum, chosen for its high thermal conductivity and lightweight properties. The **Blue Anodized** finish is not just for aesthetics; it provides a layer of protection against corrosion and slightly increases emissivity for better radiant heat transfer. #### B. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a mechanical **pushPIN™** system. This consists of: * **Pins:** Usually made of brass or plastic, designed to fit into pre-drilled holes on the PCB. * **Compression Springs:** These provide a precise "normal force" (pressure) to ensure maximum contact between the heat sink and the chip, improving heat transfer efficiency. #### C. Fin Geometry The "F" in the part number denotes a specific fin pattern. These are high-density fins designed to maximize surface area. This allows for better heat dissipation when air flows through the sink (forced convection via a fan). #### D. Thermal Interface Material (TIM) The unit comes with **T412** pre-applied to the base. * **Function:** It fills the microscopic air gaps between the chip surface and the heat sink base. * **Performance:** T412 is a high-efficiency thermal tape/grease that ensures low thermal resistance. --- ### 3. Performance Summary The thermal resistance of this part varies based on the airflow (measured in Linear Feet per Minute - LFM): * **Unducted Flow:** Higher resistance (approx. 7.5°C/W at 200 LFM). * **Ducted Flow:** Lower resistance, meaning it performs significantly better when air is channeled directly through the fins.