The **ATS-08F-115-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) to prevent thermal throttling or hardware failure. --- ### 1. Key Technical Specifications | Parameter | Specification | Description | | :--- | :--- | :--- | | **Part Number** | ATS-08F-115-C1-R0 | Manufacturer Identification | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Fin Style** | Straight | Vertical fins for optimized airflow | | **Attachment Method** | pushPIN™ | Spring-loaded mechanism for secure mounting | | **Thermal Resistance** | 5.30°C/W (@ 100 LFM) | Lower is better for heat dissipation | | **Finish** | Blue Anodized | Protects against corrosion and increases emissivity | --- ### 2. Component Design & Dimensions This heat sink belongs to the **pushPIN™** series, which is engineered for rapid and secure assembly onto Printed Circuit Boards (PCBs). * **Footprint:** 40mm x 40mm (Square base). * **Height:** 20mm (Low profile for compact electronic enclosures). * **Thermal Interface Material (TIM):** Typically comes with pre-applied **T766** phase-change material to ensure a low-resistance thermal path between the chip and the aluminum base. --- ### 3. Application Use Cases The ATS-08F-115-C1-R0 is commonly used in electronic environments where forced air (fans) or natural convection is present: 1. **Network Hardware:** Cooling processors in routers, switches, and gateways. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. 4. **Telecommunications:** Cooling FPGA and ASIC chips in signal processing units. --- ### 4. Installation Mechanism The **pushPIN™** system uses a flexible, spring-loaded pin. This provides several benefits over adhesive-based heat sinks: * **Uniform Pressure:** Ensures the TIM is evenly compressed across the component. * **Vibration Resistance:** The springs absorb mechanical shock, making it ideal for mobile or industrial equipment. * **Reusability:** Can be removed and reinstalled easily during maintenance or chip upgrades.