The **ATS-61300W-C2-R0** is a high-performance thermal management component, specifically a **Heat Sink** from the *maxiFLOW™* series manufactured by **Advanced Thermal Solutions (ATS)**. Below is a detailed breakdown of its technical specifications and electronic application characteristics. --- ### 1. Technical Specifications This component is designed for high-power electronic cooling, typically used in telecom, networking, and industrial computing environments. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | maxiGRIP™ (Steady pressure clip) | | **Thermal Resistance** | 0.90 °C/W @ 200 LFM | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 24.50mm | | **Airflow Direction** | Directional (High-performance fin geometry) | | **Interface Material** | T766 (Thermal Tape) | --- ### 2. Key Electronic Features #### A. maxiFLOW™ Fin Geometry Unlike standard extruded heat sinks, the ATS-61300W uses a unique **tapered fin design**. This design increases the surface area for heat dissipation while minimizing pressure drop across the device. This is critical for densely packed electronic PCBs where airflow might be restricted. #### B. maxiGRIP™ Attachment System One of the most significant electronic parts of this assembly is the **maxiGRIP™ clip**. * **No Holes Required:** It attaches directly to the component (like an FPGA or CPU) without requiring mounting holes in the PCB. * **Constant Pressure:** It applies steady, even pressure across the thermal interface material (TIM), ensuring maximum heat transfer. * **Reliability:** Meets shock and vibration requirements for industrial electronic standards. #### C. Thermal Interface Material (TIM) The "C2" in the part number often refers to the factory-applied thermal interface. The **T766** tape provides a low thermal resistance path between the electronic chip (heat source) and the aluminum sink, filling microscopic air gaps that would otherwise insulate the chip. --- ### 3. Common Applications This part is typically paired with the following electronic components: * **BGA (Ball Grid Array) Packages:** High-speed processors and chipsets. * **FPGAs/ASICs:** Field Programmable Gate Arrays that generate significant heat in localized spots. * **Voltage Regulators:** High-density power modules. ---