ATS-61325R-C1-R0
AI

The **ATS-61325R-C1-R0** is a high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW™" series, specifically designed for cooling electronic components such as processors, FPGAs, and ASICs.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of this specific part:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | maxiFLOW™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 32.2mm x 32.2mm x 24.7mm |
| **Attachment Method** | maxiGRIP™ (Spring Clip) |
| **Thermal Resistance** | 2.1 °C/W @ 200 LFM |
| **Shape** | Square (Finned) |
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### 2. Key Design Features
* **maxiFLOW™ Geometry:** The heat sink features a tapered fin design that maximizes surface area for radiant cooling while minimizing pressure drop, allowing air to flow more effectively through the fins.
* **maxiGRIP™ Attachment:** This is a specialized mechanical attachment system. It uses a plastic frame clip and a stainless steel spring clip to apply steady pressure to the component without requiring holes in the PCB.
* **High Aspect Ratio:** The fins are tall (24.7mm) relative to the base, which is ideal for systems with high-density components where vertical space is available but horizontal space is limited.
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### 3. Electronic Application
This part is typically used in the following electronic environments:
1. **Telecommunications:** Cooling high-speed networking chips.
2. **Data Centers:** Managing thermals for server-side processors.
3. **Industrial Controls:** Ensuring reliability for power-heavy control units.
4. **Prototyping:** Since it uses a clip-on system (maxiGRIP), it is excellent for testing components because it can be removed and reattached easily without permanent adhesive.
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### 4. Comparison to Standard Heat Sinks
Unlike standard "pin fin" or "extruded" heat sinks, the ATS-61325R-C1-R0 is engineered for **forced convection** (airflow from fans). The blue anodized coating is not just for aesthetics; it increases thermal emissivity and protects the aluminum from corrosion.
- ⤷What is the difference between maxiGRIP and standard thermal adhesive for this part?
- ⤷ How does the air flow direction affect the cooling efficiency of this heat sink?
- ⤷ Is this heat sink compatible with standard BGA chip sizes?