The **ATS-61330W-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** designed by Advanced Thermal Solutions (ATS). It belongs to the "maxiFLOW™" product line, engineered to optimize airflow and heat dissipation for electronic integrated circuits (ICs). --- ### 1. Technical Specifications The following table summarizes the key physical and thermal properties of this specific model: | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-61330W-C2-R0 | | **Heat Sink Type** | maxiFLOW™ | | **Material** | Aluminum (with Blue Anodized finish) | | **Dimensions (L x W x H)** | 33mm x 33mm x 24.5mm | | **Thermal Resistance** | 2.0° C/W (at 200 LFM) | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Interface Material** | T766 (Thermal Tape) | --- ### 2. Key Electronic Features #### A. Thermal Management (Efficiency) This part is designed to sit atop high-heat components like CPUs, GPUs, FPGAs, or ASICs. The **maxiFLOW™** design features a spread-fin geometry that increases surface area and reduces pressure drop, allowing heat to transfer more efficiently from the silicon die to the surrounding air. #### B. The maxiGRIP™ Attachment System Unlike permanent epoxy or simple adhesives, this part uses the maxiGRIP™ system: * **Plastic Frame Clip:** Reaches around the component and snaps into place. * **Stainless Steel Spring Clip:** Provides high, consistent pressure to ensure optimal contact between the heat sink and the chip. * **Removability:** Allows for easy maintenance or replacement without damaging the PCB or the chip. #### C. Thermal Interface Material (TIM) The model comes pre-applied with **T766 phase-change material**. This material fills the microscopic air gaps between the chip surface and the heat sink base, significantly reducing thermal impedance. --- ### 3. Application Use Cases This specific size (33mm) is typically used in: * **Networking Hardware:** Routers, switches, and high-speed modems. * **Industrial Computing:** Embedded systems that require passive or forced-air cooling. * **Power Supplies:** Cooling voltage regulators or power modules.