The **ATS-61350W-C1-R0** is a high-performance thermal management solution, specifically a **Heat Sink** designed for high-power electronic components. It belongs to the *maxiFLOW™* series manufactured by Advanced Thermal Solutions (ATS). --- ## 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | maxiFLOW™ | | **Material** | Anodized Aluminum (Blue) | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Dimensions** | 35.0mm x 35.0mm | | **Height** | 24.5mm | | **Thermal Resistance** | 2.05° C/W @ 200 LFM | | **Airflow Direction** | Side (Horizontal) | --- ## 2. Key Electronic Components it Protects While the ATS-61350W-C1-R0 is not an active electronic component itself, it is engineered to protect specific types of integrated circuits (ICs): * **BGA (Ball Grid Array) Packages:** Its footprint is optimized for square BGA chips (35mm x 35mm). * **CPUs and Microcontrollers:** Used in embedded systems where localized cooling is required. * **FPGAs & ASICs:** Essential for high-gate-count chips that generate significant heat during high-speed data processing. * **Telecommunications Gear:** Commonly found in routers, switches, and base station hardware. --- ## 3. Design Features ### A. maxiFLOW™ Fin Geometry The "W" in the part number often refers to the **spread fin design**. Unlike straight-fin heat sinks, these fins flare outward. This increases the surface area and creates turbulence, which significantly improves heat dissipation in low-airflow environments. ### B. maxiGRIP™ Attachment One of the most critical "electronic-friendly" features is the **maxiGRIP™** system: 1. **Plastic Frame Clip:** A frame snaps around the perimeter of the component. 2. **Stainless Steel Spring:** A "steady-force" spring clip applies uniform pressure across the chip. 3. **No Holes Required:** It eliminates the need to drill holes into the PCB, preserving circuit trace integrity. ### C. Interface Material The part typically comes with a **Phase Change Material (PCM)** or high-performance thermal tape pre-applied to the base. This ensures there are no microscopic air gaps between the chip and the aluminum, maximizing heat transfer. --- ## 4. Part Number Breakdown * **ATS:** Advanced Thermal Solutions (Manufacturer) * **61350:** Designates the series and specific footprint (35mm). * **W:** High-performance "Wide" fin geometry. * **C1:** Indicates the type of thermal interface material or coating. * **R0:** Revision code or packaging standard.