ATS-61375K-C1-R0_17
AI

The **ATS-61375K-C1-R0** is a high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, specifically designed for thermal management of electronic components like CPUs, GPUs, FPGAs, and ASICs.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this specific part:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (Black Anodized) |
| **Dimensions (L x W x H)** | 37.50 mm x 37.50 mm x 14.50 mm |
| **Attachment Method** | maxiGRIP™ (Frame Clip) |
| **Thermal Resistance** | 3.20 °C/W (at 200 LFM) |
| **Fin Style** | Tapered Fin (maxiFLOW™) |
| **Interface Material** | Pre-applied Thermal Interface Material (TIM) |
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### 2. Key Features and Design
#### A. maxiFLOW™ Fin Geometry
The tapered fin design increases the surface area for heat dissipation while maintaining a low pressure drop. This allows air to flow more effectively through the fins, making it ideal for high-density electronic enclosures.
#### B. maxiGRIP™ Attachment
One of the most critical aspects of this part is its mounting system:
* **The Frame:** A plastic frame attaches directly to the PCB around the component.
* **The Spring Clip:** A "steady-state" spring clip provides constant pressure across the heat sink to ensure optimal contact with the semiconductor die.
* **Advantage:** It eliminates the need to drill holes in the PCB, saving board space and reducing risk of mechanical stress.
#### C. Thermal Interface Material (TIM)
The unit comes with a pre-applied phase-change or high-performance thermal pad. This ensures that the microscopic gaps between the heat sink base and the electronic component are filled, minimizing thermal resistance.
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### 3. Application Use-Cases
This component is typically found in:
* **Networking Equipment:** High-speed routers and switches.
* **Industrial Computing:** Embedded systems requiring passive or active cooling.
* **Telecommunications:** Base stations and signal processing units.
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### 4. Part Number Breakdown
While manufacturer codes vary, the structure for this series usually follows:
1. **ATS:** Advanced Thermal Solutions (Manufacturer).
2. **61375:** Indicates the footprint size (approx. 37.5mm).
3. **K:** Fin height/style indicator.
4. **C1:** Color/Finish code (Black Anodized).
5. **R0:** Revision/Packaging code.
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What is the difference between the maxiGRIP and superGRIP attachment methods?
- ⤷ How does the air flow velocity (LFM) impact the thermal resistance of this heat sink?
- ⤷ Can this heat sink be used with components larger than 37.5mm?