Electronic Components Datasheet Search
  British  ▼
ALLDATASHEET.CO.UK

X  

  • ATS-61375K-C1-R0_17

  • AI
    The **ATS-61375K-C1-R0** is a high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, specifically designed for thermal management of electronic components like CPUs, GPUs, FPGAs, and ASICs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Black Anodized) | | **Dimensions (L x W x H)** | 37.50 mm x 37.50 mm x 14.50 mm | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Thermal Resistance** | 3.20 °C/W (at 200 LFM) | | **Fin Style** | Tapered Fin (maxiFLOW™) | | **Interface Material** | Pre-applied Thermal Interface Material (TIM) | --- ### 2. Key Features and Design #### A. maxiFLOW™ Fin Geometry The tapered fin design increases the surface area for heat dissipation while maintaining a low pressure drop. This allows air to flow more effectively through the fins, making it ideal for high-density electronic enclosures. #### B. maxiGRIP™ Attachment One of the most critical aspects of this part is its mounting system: * **The Frame:** A plastic frame attaches directly to the PCB around the component. * **The Spring Clip:** A "steady-state" spring clip provides constant pressure across the heat sink to ensure optimal contact with the semiconductor die. * **Advantage:** It eliminates the need to drill holes in the PCB, saving board space and reducing risk of mechanical stress. #### C. Thermal Interface Material (TIM) The unit comes with a pre-applied phase-change or high-performance thermal pad. This ensures that the microscopic gaps between the heat sink base and the electronic component are filled, minimizing thermal resistance. --- ### 3. Application Use-Cases This component is typically found in: * **Networking Equipment:** High-speed routers and switches. * **Industrial Computing:** Embedded systems requiring passive or active cooling. * **Telecommunications:** Base stations and signal processing units. --- ### 4. Part Number Breakdown While manufacturer codes vary, the structure for this series usually follows: 1. **ATS:** Advanced Thermal Solutions (Manufacturer). 2. **61375:** Indicates the footprint size (approx. 37.5mm). 3. **K:** Fin height/style indicator. 4. **C1:** Color/Finish code (Black Anodized). 5. **R0:** Revision/Packaging code.
    ✨ Follow-up Questions
    • What is the difference between the maxiGRIP and superGRIP attachment methods?
    • How does the air flow velocity (LFM) impact the thermal resistance of this heat sink?
    • Can this heat sink be used with components larger than 37.5mm?