The **ATS-61375W-C2-R0** is a high-performance thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. Specifically, it is a high-aspect-ratio heat sink designed for cooling electronic components in constrained spaces. ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-61375W-C2-R0 | | **Material** | Aluminum | | **Finish** | Black Anodized | | **Dimensions (L x W x H)** | 37.5mm x 37.5mm x 24.5mm | | **Attachment Method** | thermal Adhesive / Tape (maxGRIP™ / superGRIP™ compatible) | | **Fin Style** | Straight Fin (High Aspect Ratio) | | **Thermal Resistance** | Variable (Approx. 2.5°C/W @ 200 LFM) | --- ### 2. Design Features The "C2" series from ATS is known for its **straight-fin** design, which is optimized for specific airflow environments: * **High Aspect Ratio:** The fins are thin and tall relative to their spacing, providing a large surface area for heat dissipation without significantly increasing the footprint of the component. * **Material Efficiency:** Made from extruded aluminum, which offers an excellent balance between thermal conductivity, weight, and cost. * **Surface Treatment:** The black anodized finish increases emissivity, which slightly improves cooling via radiation and protects the aluminum from corrosion. --- ### 3. Application Use Cases This specific heat sink is typically used in the following electronic sectors: 1. **Telecommunications:** Cooling high-speed processors in routers, switches, and base stations. 2. **Embedded Computing:** Protecting SoCs (System on Chips) or FPGAs that generate significant heat in compact enclosures. 3. **Power Electronics:** Managing heat for power converters and high-density power modules. ### 4. Mounting and Thermal Interface To achieve the rated performance, the ATS-61375W-C2-R0 requires a high-quality **Thermal Interface Material (TIM)**. It is often paired with: * **Thermal Tape:** For quick, low-profile attachment. * **Mechanical Clips:** Using the ATS maxGRIP™ or superGRIP™ frame systems which provide high pressure and vibration resistance without requiring holes in the PCB. ---