The **ATS-61425D-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, specifically designed for cooling high-power electronic components like CPUs, GPUs, FPGAs, and ASICs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Anodized Aluminum (Blue) | | **Dimensions** | 42.00mm x 42.00mm x 9.50mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 2.50°C/W (at 200 LFM) | | **Flow Direction** | Directional (High fin density) | --- ### 2. Key Electronic Features #### A. Thermal Interface Material (TIM) The "R0" suffix usually indicates that the heat sink comes pre-applied with **Chomerics T766**, a high-performance phase-change thermal interface material. This ensures low contact resistance between the electronic die and the aluminum base. #### B. pushPIN™ Attachment Unlike adhesive tapes that can fail under high heat, this part uses a mechanical **pushPIN™** system. This provides: - **Consistent Pressure:** Ensures the thermal interface material is compressed evenly. - **Reliability:** Secure mounting even in environments prone to shock or vibration. - **Easy Installation:** Can be installed manually or with automated equipment. #### C. Fin Geometry The maxiFLOW™ design features a flared fin structure. This is critical for electronics because it increases the surface area for heat dissipation while maintaining a low pressure drop, making it highly efficient for forced-air cooling systems. --- ### 3. Common Applications This specific footprint (42mm x 42mm) is common in the following electronic sectors: * **Networking:** Routers, switches, and base stations. * **Computing:** High-speed memory controllers and chipsets. * **Industrial:** Power modules and motor controllers.