The **ATS-P2-75-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from integrated circuits (ICs), such as CPUs, GPUs, or power transistors, to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The model name follows a specific nomenclature that defines its physical and thermal properties: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ Heat Sink | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 25mm x 25mm | | **Height** | 30.00mm | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | ~14.95°C/W (Unducted @ 100 LFM) | --- ### 2. Key Features & Components #### A. Fin Design (Straight Fin) The "P2" designation typically refers to a specific fin density and geometry. This model uses a vertical fin array optimized for **forced air convection** (fans). The spacing between fins is calculated to balance surface area with pressure drop. #### B. Push-Pin Attachment Mechanism Instead of messy adhesives or simple clips, this part uses the **pushPIN™** system: * **Springs:** Provides consistent pressure (preload) across the component surface for maximum heat transfer. * **Pins:** Designed to fit into pre-drilled holes on a Printed Circuit Board (PCB). #### C. Phase Change Material (TIM) The "R0" suffix usually indicates the inclusion of a **Thermal Interface Material (TIM)** pre-applied to the base. This fills microscopic air gaps between the heat sink and the electronic chip, significantly lowering thermal resistance. --- ### 3. Electronic Application This part is commonly found in industrial and telecommunications electronics where space is limited but heat density is high. * **Target Components:** High-speed ASICs, FPGAs, and small form-factor processors. * **Environment:** Best used in chassis with active airflow (fans) rather than passive, sealed enclosures. ---