### Overview of ATS-P2-76-C2-R0 The **ATS-P2-76-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **push-pin** attachment series, specifically designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits that require efficient thermal dissipation in tight spaces. --- ### Technical Specifications The following table outlines the key physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-P2-76-C2-R0 | | **Thermal Resistance** | 27.33°C/W (at 100 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 10.00mm | | **Fin Style** | Straight (Square) | --- ### Component Breakdown #### 1. Heat Sink Body (Aluminum) The core of the part is made from high-grade aluminum. Aluminum is chosen for its excellent thermal conductivity-to-weight ratio. The **Blue Anodized** finish is not just for aesthetics; it provides surface protection against corrosion and slightly increases emissivity for better radiant heat transfer. #### 2. Push-Pin Mounting System Instead of using messy thermal adhesives or complex brackets, this part uses a **Brass Push-Pin**. * **Mechanism:** The pin is pushed through pre-drilled holes in the PCB. * **Benefit:** It provides consistent pressure across the interface, ensuring optimal contact with the electronic chip. #### 3. Compression Spring A high-tension spring is wrapped around the push-pin. This ensures that even under mechanical vibration or thermal expansion/contraction, the heat sink remains firmly pressed against the component, preventing "air gaps" that could lead to overheating. #### 4. Thermal Interface Material (TIM) While the base part number typically refers to the hardware, the "C2" variant often implies a pre-applied **Thermal Interface Material** (like T766) on the base of the heat sink. This fills microscopic air gaps between the chip and the aluminum base. --- ### Applications * **Telecommunications:** Cooling for small-form-factor networking gear. * **Embedded Systems:** Industrial PCs where space is limited but cooling is critical. * **Power Supplies:** Heat dissipation for MOSFETs and voltage regulators.