The **ATS-P2-79-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "maxiFLOW™" series, designed for cooling electronic components like CPUs, GPUs, and ASICs. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Dimensions** | 30mm x 30mm | | **Height** | 20mm | | **Thermal Resistance** | 2.63°C/W (at 200 LFM) | | **Pressure Drop** | 0.25 in. H2O (at 200 LFM) | | **Airflow Pattern** | Straight Fin / Spread Fin | --- ### 2. Key Design Features * **maxiFLOW™ Geometry:** Features a unique "flared" fin design that maximizes the surface area for convective heat transfer while minimizing pressure drop. * **pushPIN™ Attachment:** Utilizes a spring-loaded mechanism that provides precise pressure to ensure optimal contact with the electronic component. * **High-Performance Interface Material (TIM):** Typically comes pre-applied with a thermal interface material (like T766) to ensure there are no air gaps between the heat sink and the chip. * **Blue Anodization:** Not only provides a professional aesthetic but also adds a layer of protection against corrosion and wear. --- ### 3. Application Use Cases This specific model is sized for medium-to-small IC (Integrated Circuit) packages. Common applications include: 1. **Networking Hardware:** Routers, switches, and bridges. 2. **Embedded Systems:** Industrial PC modules and single-board computers. 3. **Power Supplies:** Cooling voltage regulators or power transistors. 4. **Telecom:** Base station processing units. --- ### 4. Thermal Performance Comparison Thermal resistance decreases as airflow (measured in Linear Feet per Minute - LFM) increases: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 5.10 | | 200 | 2.63 | | 400 | 1.80 | | 600 | 1.45 |