The **ATS-X53450P-C1-R0** is a high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "SuperGrip" series, designed for cooling high-power electronic components such as BGAs (Ball Grid Arrays), processors, and FPGAs. --- ### 1. Technical Specifications The following table highlights the core physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Body) / Copper (optional base versions) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 5.8mm | | **Attachment Method** | SuperGrip (Frame & Clip) | | **Thermal Resistance** | ~4.5° C/W (at 200 LFM) | | **Compliance** | RoHS Compliant | --- ### 2. Key Components & Features #### A. Thermal Interface Material (TIM) The part typically comes pre-applied with a high-performance thermal pad or phase-change material. This ensures that the microscopic gaps between the electronic component (heat source) and the heat sink are filled, minimizing thermal resistance. #### B. The SuperGrip™ Attachment System Unlike traditional heat sinks that use adhesives or push-pins, this part uses a two-piece mechanical system: 1. **Plastic Frame Clip:** This snaps securely around the perimeter of the electronic component (BGA). 2. **Metal "U" Spring Clip:** This applies a specific downward force (pressure) to ensure optimal contact between the sink and the chip without damaging the PCB solder joints. #### C. Low-Profile Fin Design With a height of only **5.8mm**, this part is specifically engineered for: * **Blade Servers:** Where vertical clearance is limited. * **Network Switches:** High-density environments with strict airflow requirements. * **Small Form Factor (SFF) PC's:** Compact electronics requiring active or passive cooling. --- ### 3. Application Use Cases This component is used in industrial and enterprise electronics where heat dissipation is critical for longevity: * **Telecom Infrastructure:** Cooling ASICs in routers and switches. * **Data Centers:** Management of heat in high-density server racks. * **Automotive Systems:** Cooling CPUs in advanced driver-assistance systems (ADAS). ---