C252012WB-R47
AI

## Analysis of C252012WB-R47
The **C252012WB-R47** is a surface-mount (SMD) wire-wound chip inductor. Based on its nomenclature, it belongs to a category of high-frequency components typically used in telecommunications and power management circuits.
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### 1. Part Number Breakdown
Understanding the alphanumeric code reveals the physical and electrical characteristics of the component:
| Code Segment | Description | Meaning |
| :--- | :--- | :--- |
| **C** | Component Type | Chip Inductor |
| **252012** | Dimensions (Metric) | 2.5mm x 2.0mm x 1.2mm |
| **WB** | Series/Construction | Wire-wound, Bonded/High Q type |
| **R47** | Inductance Value | 0.47 µH (microhenries) |
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### 2. Electrical Specifications
While specific datasheets vary by manufacturer (such as Taiyo Yuden or Bourns), a standard R47 wire-wound inductor in this footprint typically follows these specifications:
* **Inductance:** 0.47 µH
* **Tolerance:** Usually ±10% (K) or ±20% (M)
* **DC Resistance (DCR):** Low (typically < 0.20 Ω) to minimize power loss.
* **Rated Current:** High relative to size (often between 500mA to 1.2A).
* **Self-Resonant Frequency (SRF):** High frequency (typically > 200 MHz), making it suitable for RF filtering.
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### 3. Key Physical Features
1. **Wire-Wound Construction:** Unlike multilayer inductors, these use a copper wire wound around a ceramic or ferrite core. This allows for higher **Q-factors** (Quality factor) and higher current carrying capacity.
2. **SMD Package:** The 2520 (1008 in Imperial) footprint is designed for automated "pick and place" assembly.
3. **Encapsulation:** Often features a resin coating or molded body to protect the wire windings from environmental factors and mechanical stress.
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### 4. Typical Applications
The C252012WB-R47 is commonly found in:
* **DC-DC Converters:** Used in power supply modules for smartphones and tablets.
* **RF Circuits:** Matching networks and decoupling in wireless communication modules (Wi-Fi, Bluetooth).
* **Signal Filtering:** Noise suppression in high-speed data lines.
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What are the main differences between wire-wound and multilayer inductors in this size?
- ⤷ How does the 'Q-factor' affect the performance of this specific inductor?
- ⤷ Can you provide the maximum operating temperature for this component series?