The **CM252016-R22M** is a surface-mount (SMD) wire-wound chip inductor commonly used in high-frequency circuits. It is part of the standard 1008 (2520 metric) series of electronic components. --- ### 1. Part Number Breakdown The part number follows a standardized naming convention used by manufacturers like **Bourns**: | Segment | Meaning | Specification | | :--- | :--- | :--- | | **CM** | Product Series | Chip Inductor, Wire-wound | | **252016** | Dimensions | 2.5mm x 2.0mm x 1.6mm (Length x Width x Height) | | **R22** | Inductance Value | 0.22 µH (Microhenries) | | **M** | Tolerance | ±20% | --- ### 2. Technical Specifications The electrical characteristics of this component define its suitability for specific RF (Radio Frequency) applications: * **Inductance:** 0.22 µH * **Case Size:** 1008 (Metric 2520) * **Q-Factor (Quality Factor):** Typically high (approx. 25–30 at a specific test frequency), indicating low energy loss. * **Self-Resonant Frequency (SRF):** Usually around 450 MHz. This is the frequency limit beyond which the part behaves like a capacitor rather than an inductor. * **DC Resistance (DCR):** Low (typically < 1.0 Ohm), which helps minimize heat dissipation and power loss. * **Rated Current:** Usually ranges between 200mA and 450mA depending on the specific manufacturer's thermal rating. --- ### 3. Key Features and Applications The wire-wound construction provides better performance compared to multilayer inductors in specific scenarios: #### Features: * **High Q-Factor:** Excellent for signal purity in resonant circuits. * **Stable Performance:** The ceramic or ferrite core provides stability across a wide temperature range. * **Small Footprint:** The 2520 package is ideal for compact PCB designs. #### Typical Applications: 1. **RF Circuits:** Used in impedance matching and filtering for wireless communication (Wi-Fi, Bluetooth). 2. **Signal Conditioning:** Decoupling and noise suppression in high-speed data lines. 3. **Power Management:** Small DC-DC converters where low-current inductance is required. --- ### 4. Footprint and Soldering The component is designed for **Pick-and-Place** automated assembly. ```markdown Land Pattern Recommendation (Approximate): - Pad Width: 2.0 mm - Pad Length: 1.0 mm - Space Between Pads: 1.2 mm ```