## Technical Specifications: CS160808-R12K The **CS160808-R12K** is a surface-mount (SMD) multilayer chip inductor. This component is commonly used in high-frequency circuits for filtering, impedance matching, and resonance. ### 1. Part Number Breakdown Understanding the nomenclature helps identify the physical and electrical characteristics: | Code Segment | Meaning | Description | | :--- | :--- | :--- | | **CS** | Series | Multilayer Chip Inductor (Standard Type) | | **160808** | Size (EIA) | 1.6mm x 0.8mm x 0.8mm (Equivalent to 0603 imperial) | | **R12** | Inductance | 0.12 µH (Microhenries) | | **K** | Tolerance | ±10% | --- ### 2. Key Electrical Characteristics Below are the typical performance parameters for this specific component: | Parameter | Value | | :--- | :--- | | **Inductance** | 120 nH (0.12 µH) | | **Tolerance** | ±10% | | **Test Frequency** | 25 MHz | | **DC Resistance (DCR)** | ~0.50 Ω (Max) | | **Rated Current** | ~300 mA (Max) | | **Self-Resonant Frequency (SRF)** | 320 MHz (Min) | | **Quality Factor (Q)** | 15 (Min) at Test Frequency | --- ### 3. Physical Features & Construction * **Material:** Often constructed with a Ceramic or Ferrite body depending on the specific frequency target. * **Termination:** Lead-free (Sn) plating over Nickel (Ni) and Copper (Cu) layers, making it compatible with reflow soldering. * **Packaging:** Supplied on 7-inch reels (tape and reel) for automated pick-and-place machines. ### 4. Typical Applications The CS160808-R12K is versatile and found in various electronic sectors: 1. **Mobile Communication:** Used in smartphones for RF signal processing. 2. **EMI Suppression:** Filtering high-frequency noise in digital circuits. 3. **WLAN/Bluetooth Modules:** Impedance matching for antennas and RF front-ends. 4. **Computer Peripherals:** Decoupling and signal integrity in motherboards and GPUs. --- ### 5. Equivalent/Alternative Formats If you are sourcing this part, it is often cross-referenced with the **0603** package size. Common manufacturers for this series include **Bourns**, **TDK**, and **Murata**.