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ATTP1A Datasheet (PDF) - Analog Technologies, Inc.

ATTP1A Datasheet PDF - Analog Technologies, Inc.
Part # ATTP1A
Download  ATTP1A Download
File Size   514.27 Kbytes
Page   8 Pages
Manufacturer  ANALOGTECHNOLOGIES [Analog Technologies, Inc.]
Direct Link  https://www.analogtechnologies.com/
Logo ANALOGTECHNOLOGIES - Analog Technologies, Inc.
Description Temperature Plate Assembly

ATTP1A Datasheet (PDF)

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ATTP1A Datasheet PDF - Analog Technologies, Inc.

Part # ATTP1A
Download  ATTP1A Click to download

File Size   514.27 Kbytes
Page   8 Pages
Manufacturer  ANALOGTECHNOLOGIES [Analog Technologies, Inc.]
Direct Link  https://www.analogtechnologies.com/
Logo ANALOGTECHNOLOGIES - Analog Technologies, Inc.
Description Temperature Plate Assembly

ATTP1A Datasheet (HTML) - Analog Technologies, Inc.


ATTP1A Product details

MAIN FEATURES
Large platform for thermal load: 66mm × 44mm
Wide temperature regulation range: –20°C to 110°C
Accurate temperature stability: 1.8mV
Response to large set-point temperature change: 20s from
10 °C to 20°C
Response to small set-point temperature change: 6s from
20°C to 21°C
High thermal load capability: 15.75W

DESCRIPTION
ATTP1A is designed for evaluating TEC controllers,
which can be easily evaluated by using this temperature
plate.
ATTP1A aims to automatically adjust the temperature
parameters based on the requested temperature range so
that the TEC controller can detect the pre-set temperature
range.
Temperature plate ATTP1A works together with TEC
controller evaluation board and TEC controller. Figure 2
shows the physical photo of ATTP1A. The TEC evaluation
board connects with ATTP1A through CON1. On the right
side of ATTP1A, it connects with a TEC module, a
thermistor, a fan and a heat sink, see Figure 1. R1 (W11,
W12, R1A), R2 (W21, W22, R2A), R3 (W31, W32, R3A)
are TEC temperature control parameters, see Figure 2.
Required temperature parameters can be achieved through
adjusting R1, R2 and R3, thus the TEC controller can
detect the temperature range that users require.
In different temperature ranges, R1, R2 and R3 have
different corresponding resistances. R1, R2 and R3 can be
determined by:
Where RHIGH is the resistance of RTH in the highest
temperature of the set temperature range; RMID is the
resistance of RTH in the medium temperature of the set
temperature range; RLOW is the resistance of RTH in the
lowest temperature of the set temperature range. For
example, set the highest temperature 35°C and the lowest
temperature 15°C, so the medium value is 25°C.
In the R-T table, RHIGH, RMID and RLOW can be achieved,
see Table 2.
RHIGH = 6.5k; RMID = 10k; RLOW = 15.7k
In accordance with the above three formulas, R1, R2 and
R3 can be calculated:
R1=18.14k; R2=8.14k; R3=75.87k
As shown in Figure 4, R1 is equal to the sum of W11
(potentiometer), W12 (potentiometer) and R1A (fixed
value resistor), that is, R1=W11+W12+R1A. So simply
adjust W11 and W12, R1 will be 8.051k. W11 provides
coarse adjustment and W12 provides fine adjustment.
The same goes to R2 and R3, that is:
R2=W21+W22+R2A
R3=W32+W33+R3A
Where W21 and W31 provide coarse tuning; W22 and
W32 provide fine tuning.
At the bottom right side of the plate, there are three
switches S1, S2, and S3, which can be used to adjust the
temperature parameters. When adjusting R1, R2 and R3,
disconnect them with circuit (turn corresponding switch to
OUT), thus the measured R1, R2 and R3 are available.
When R1, R2 and R3 are all adjusted to the required
resistance, turn on all switches (switch to IN).
Solder pad TP11 and TP12 are test points of R1. When the
switch is off, use resistance function of the multimeter and
connect its two test leads to TP11 and TP12. At this time,
adjust W11 and W12, the resistance of R1 can be read in
the meter. Users can tune R1 on the basis of calculated
temperature parameters and get the required resistance
from the multimeter. This method is also applied to R2 and
R3. TP21 and TP22 can be used to test R2; TP31 and TP32
can be used to test R3.
There are solder joints on the sides of the board. These
solder joints can be used to connect with external devices
or components. Test lines of other devices can be placed
into the holes of solder pads directly.




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