1.1 Features
MCU
• ESP32-D0WD-V3 embedded, Xtensa® dual-core
32-bit LX6 microprocessor, up to 240 MHz
• 448 KB ROM for booting and core functions
• 520 KB SRAM for data and instructions
• 16 KB SRAM in RTC
WiFi
• 802.11b/g/n
• Bit rate: 802.11n up to 150 Mbps
• A-MPDU and A-MSDU aggregation
• 0.4 μs guard interval support
• Center frequency range of operating channel:
2412 ~ 2484 MHz
Bluetooth®
• Bluetooth V4.2 BR/EDR and Bluetooth LE
specification
• Class-1, class-2 and class-3 transmitter
• AFH
• CVSD and SBC
Hardware
• Interfaces: SD card, UART, SPI, SDIO, I2C, LED
PWM, Motor PWM, I2S, IR, pulse counter, GPIO,
capacitive touch sensor, ADC, DAC, Two-Wire
Automotive Interface (TWAI®, compatible with
ISO11898-1)
• 40 MHz crystal oscillator
• 4 MB SPI flash
• Operating voltage/Power supply: 3.0 ~ 3.6 V
• Operating temperature range: –40 ~ 85 °C
• Dimensions: See Table 1
Certification
• Bluetooth certification: BQB
• RF certification: FCC/CE-RED/SRRC
• Green certification: REACH/RoHS