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MPC750EC/D Datasheet (PDF) - NXP Semiconductors

MPC750EC/D Datasheet PDF - NXP Semiconductors
Part # MPC750EC/D
Download  MPC750EC/D Download
File Size   717.44 Kbytes
Page   44 Pages
Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors
Description MPC750A RISC Microprocessor Hardware Specifications

MPC750EC/D Datasheet (PDF)

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MPC750EC/D Datasheet PDF - NXP Semiconductors

Part # MPC750EC/D
Download  MPC750EC/D Click to download

File Size   717.44 Kbytes
Page   44 Pages
Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors
Description MPC750A RISC Microprocessor Hardware Specifications

MPC750EC/D Datasheet (HTML) - NXP Semiconductors


MPC750EC/D Product details

Features
This section summarizes features of the MPC750’s implementation of the PowerPC architecture. Major
features of the MPC750 are as follows:
• Branch processing unit
— Four instructions fetched per clock
— One branch processed per cycle (plus resolving 2 speculations)
— Up to 1 speculative stream in execution, 1 additional speculative stream in fetch
— 512-entry branch history table (BHT) for dynamic prediction
— 64-entry, 4-way set associative branch target instruction cache (BTIC) for eliminating branch
delay slots
• Dispatch unit
— Full hardware detection of dependencies (resolved in the execution units)
— Dispatch two instructions to six independent units (system, branch, load/store, fixed-point unit
1, fixed-point unit 2, or floating-point)
— Serialization control (predispatch, postdispatch, execution serialization)
• Decode
— Register file access
— Forwarding control
— Partial instruction decode
• Load/store unit
— One cycle load or store cache access (byte, half-word, word, double-word)
— Effective address generation
— Hits under misses (one outstanding miss)
— Single-cycle misaligned access within double word boundary
— Alignment, zero padding, sign extend for integer register file
— Floating-point internal format conversion (alignment, normalization)
— Sequencing for load/store multiples and string operations
— Store gathering
— Cache and TLB instructions
— Big- and little-endian byte addressing supported
— Misaligned little-endian support in hardware
• Fixed-point units
— Fixed-point unit 1 (FXU1)—multiply, divide, shift, rotate, arithmetic, logical
— Fixed-point unit 2 (FXU2)—shift, rotate, arithmetic, logical
— Single-cycle arithmetic, shift, rotate, logical
— Multiply and divide support (multi-cycle)
— Early out multiply
• Floating-point unit
— Support for IEEE-754 standard single- and double-precision floating-point arithmetic
— 3 cycle latency, 1 cycle throughput, single-precision multiply-add
— 3 cycle latency, 1 cycle throughput, double-precision add
— 4 cycle latency, 2 cycle throughput, double-precision multiply-add
— Hardware support for divide
— Hardware support for denormalized numbers
— Time deterministic non-IEEE mode
• System unit
— Executes CR logical instructions and miscellaneous system instructions
— Special register transfer instructions
• Cache structure
— 32K, 32-byte line, 8-way set associative instruction cache
— 32K, 32-byte line, 8-way set associative data cache
— Single-cycle cache access
— Pseudo-LRU replacement
— Copy-back or write-through data cache (on a page per page basis)
— Supports all PowerPC memory coherency modes
— Non-blocking instruction and data cache (one outstanding miss under hits)
— No snooping of instruction cache
• Memory management unit
— 128 entry, 2-way set associative instruction TLB
— 128 entry, 2-way set associative data TLB
— Hardware reload for TLBs
— 4 instruction BATs and 4 data BATs
— Virtual memory support for up to 4 exabytes (252) of virtual memory
— Real memory support for up to 4 gigabytes (232) of physical memory
• Level 2 (L2) cache interface (not implemented on MPC740)
— Internal L2 cache controller and 4K-entry tags; external data SRAMs
— 256K, 512K, and 1 Mbyte 2-way set associative L2 cache support
— Copy-back or write-through data cache (on a page basis, or for all L2)
— 64-byte (256K/512K) and 128-byte (1-Mbyte) sectored line size
— Supports flow-through (reg-buf) synchronous burst SRAMs, pipelined (reg-reg) synchronous
burst SRAMs, and pipelined (reg-reg) late-write synchronous burst SRAMs
— Core-to-L2 frequency divisors of ÷1, ÷1.5, ÷2, ÷2.5, and ÷3 supported
• Bus interface
— Compatible with 60x processor interface
— 32-bit address bus
— 64-bit data bus
— Bus-to-core frequency multipliers of 3x, 3.5x, 4x, 4.5x, 5x, 5.5x, 6x, 6.5x, 7x, 7.5x, 8x
supported
• Integrated power management
— Low-power 2.6/3.3-volt design
— Three static power saving modes: doze, nap, and sleep
• Integrated Thermal Management Assist Unit
— On-chip thermal sensor and control logic
— Thermal Management Interrupt for software regulation of junction temperature.
• Testability
— LSSD scan design
— JTAG interface
• Reliability and serviceability—Parity checking on 60x and L2 cache buses




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About NXP Semiconductors


NXP Semiconductors is a publicly traded multinational company that designs, develops, and manufactures a wide range of semiconductors and integrated circuits for various applications, including automotive, industrial, communications, and consumer markets.

The company was founded in 2006 and is headquartered in Eindhoven, Netherlands.

NXP offers a broad portfolio of products, including microcontrollers, microprocessors, secure authentication ICs, power management ICs, RF and microwave components, and sensor solutions, among others.

The company's products are designed to be energy efficient, secure, and reliable, and are used in a variety of applications, including automotive systems, industrial automation and control, smart homes and buildings, and connected devices.

NXP is dedicated to innovation and customer satisfaction, and is committed to providing its customers with the best semiconductor solutions to meet their needs.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.




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