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IMXRT1170IEC Datasheet (PDF) - NXP Semiconductors

IMXRT1170IEC Datasheet PDF - NXP Semiconductors
Part # IMXRT1170IEC
Download  IMXRT1170IEC Download
File Size   3040.4 Kbytes
Page   136 Pages
Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors
Description i.MX RT1170 Crossover Processors Data Sheet for Industrial Products

IMXRT1170IEC Datasheet (PDF)

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IMXRT1170IEC Datasheet PDF - NXP Semiconductors

Part # IMXRT1170IEC
Download  IMXRT1170IEC Click to download

File Size   3040.4 Kbytes
Page   136 Pages
Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors
Description i.MX RT1170 Crossover Processors Data Sheet for Industrial Products

IMXRT1170IEC Datasheet (HTML) - NXP Semiconductors


IMXRT1170IEC Product details

1.1 Features
The i.MX RT1170 processors are based on Arm Cortex®-M7 Core™ Platform, which has the following
features:
• The Arm Cortex-M7 Core Platform:
— 32 KB L1 Instruction Cache and 32 KB L1 Data Cache
— Floating Point Unit (FPU) with single-precision and double-precision support of Armv7-M
Architecture FPv5
— Support the Arm®v7-M Thumb instruction set, defined in the Armv7-M architecture
— Integrated Memory Protection Unit (MPU), up to 16 individual protection regions
— Up to 512 KB I-TCM and D-TCM in total
— Frequency of 800 MHz with Forward Body Biasing (FBB)
— ECC support for both cache and TCM
— Frequency of the core, as per Table 11, "Operating ranges," on page 28.
• The Arm Cortex®-M4 Core platform:
— Cortex-M4 processor with single-precision FPU defined by Armv7-M architecture FPv4-SP
— Integrated MPU with 8 individual protection regions
— 16 KB Instruction Cache, 16 KB Data Cache, and 256 KB TCM
— Frequency of 400 MHz without body biasing
— ECC support for TCM and parity check support for cache
The SoC-level memory system consists of the following additional components:
— Boot ROM (256 KB)
— On-chip RAM (2 MB in total)
– Configurable 512 KB RAM shared with M7 TCM
– 256 KB RAM shared with M4 TCM
– Dedicated 1.25 MB OCRAM
— Secure always-on RAM (4 KB)
• External memory interfaces:
— 8/16/32-bit SDRAM, up to SDRAM-133/SDRAM-166/SDRAM-200
— 8/16-bit SLC NAND FLASH
— SD/eMMC
— SPI NOR/NAND FLASH
— Parallel NOR FLASH with XIP support
— Single/Dual channel Quad SPI FLASH with XIP support
— Hyper RAM/FLASH
— OCT FLASH
— Synchronization mode for all devices
• Timers and PWMs:
— Six General Programmable Timer (GPT) modules
– 4-channel generic 32-bit resolution timer for each
– Each supports standard capture and compare operation
— Two Periodical Interrupt Timer (PIT) modules
– Four timers for each module
– Generic 32-bit resolution timer
– Periodical interrupt generation
— Four Quad Timer (QTimer) modules
– 4-channel generic 16-bit resolution timer for each
– Each supports standard capture and compare operation
– Quadrature decoder integrated
— Four FlexPWMs
– Up to 8 individual PWM channels for each
– 16-bit resolution PWM suitable for Motor Control applications
— Four Quadrature Decoders
— Four Watch Dog (WDOG) modules
Each i.MX RT1170 processor enables the following interfaces to external devices (some of them are
muxed and not available simultaneously):
• Display Interface:
— Parallel RGB LCD interface (eLCDIF)
– Support 8/16/24-bit interface
– Support up to WXGA resolution @60fps
– Support Index color with 256 entry x 24-bit color LUT
— Parallel RGB LCD Interface Version 2 (LCDIFv2)
– Enhanced based on LCDIF version
– Support up to 8 layers of alpha blending
— MIPI Display Serial Interface (MIPI DSI)
– PHY integrated
– 2 data lanes interface with up to 1.5 GHz bit rate clock
— Smart LCD Display with 8080 interface through SEMC
• Audio:
— SPDIF input and output
— Four Synchronous Audio Interface (SAI) modules supporting I2S, AC97, TDM, and
codec/DSP interfaces
— Medium Quality Sound (MQS) interface via GPIO pads
— PDM microphone interface with 4 pairs of inputs
— Asynchronous Sample Rate Converter (ASRC)
• Graphics engine:
— Generic 2D (PXP)
– BitBlit
– Flexible image composition options—alpha, chroma key
– Porter-duff blending
– Image rotation (90, 180, 270)
– Image resize
– Color space conversion
– Multiple pixel format support (RGB, YUV444, YUV422, YUV420, YUV400)
– Standard 2D-DMA operation
— Vector Graphics Processing
– Real-time hardware curve tessellation of lines, quadratic, and cubic Bezier curves
– 16x Line Anti-aliasing
– OpenVG 1.1 support
– Vector Drawing
• Camera Interface:
— Parallel Camera Sensor Interface (CSI)
– Support 24-bit, 16-bit, and 8-bit input
– Barcode binarization and histogram statistics
— MIPI Camera Serial Interface (MIPI CSI)
– PHY integrated
– 2 data lanes interface with up to 1.5 GHz bit rate clock
• Connectivity:
— Two USB 2.0 OTG controllers with integrated PHY interfaces
— Two Ultra Secure Digital Host Controller (uSDHC) interfaces
– eMMC 5.0 compliance with HS400 support up to 400 MB/sec
– SD/SDIO 3.0 compliance with 200 MHz SDR signaling to support up to 100 MB/sec
– Support for SDXC (extended capacity)
— One 10M/100M Ethernet controller with support for IEEE1588
— One Gigabit Ethernet controller with support for AVB
— One Gigabit Ethernet controller with Time Sensitive Networking (TSN) Capability
— Twelve universal asynchronous receiver/transmitter (UARTs) modules
— Six I2C modules
— Six SPI modules
— Three FlexCAN (with Flexible Data-rate supported) modules
— Two EMV SIM modules
• Analog:
— Two Analog-Digital-Converters (ADC), which supports both differential and single-end inputs
— One Digital-Analog-Converter (DAC)
— Four Analog Comparators (ACMP)
• GPIO and Pin Multiplexing:
— General-purpose input/output (GPIO) modules with interrupt capability
— Input/output multiplexing controller (IOMUXC) to provide centralized pad control
— Two FlexIO modules
— 8 x 8 keypad
The i.MX RT1170 processors integrate advanced power management unit and controllers:
• Full PMIC integration, including on-chip DCDC and LDOs
• Temperature sensor with programmable trim points
• Hardware power management controller (GPC)
The i.MX RT1170 processors support the following system debug:
• Arm CoreSight debug and trace architecture
• Trace Port Interface Unit (TPIU) to support off-chip real-time trace
• Cross Triggering Interface (CTI)
• Support for 5-pin (JTAG) and SWD debug interfaces
Security functions are enabled and accelerated by the following hardware:
• High Assurance Boot (HAB)
• Cryptographic Acceleration and Assurance (CAAM) module:
— Public Key Cryptography Engine (PKHA)
— Symmetric Engines
— Cryptographic Hash Engine
— Random Number Generation (RNG4)
— Four Job Rings for use by processors
— Secure Hardware-Only Cryptographic Key Management
— Encrypted Boot
— Revision control check based on fuse values
— DEK includes IV
— Side channel attack countermeasures
— 64 KB secure RAM
• Inline Encryption Engine (IEE):
— External memory encryption/decryption
— I/O direct encrypted storage and retrieval (Stream Support)
— FlexSPI decryption only
• On-the-Fly AES Decryption (OTFAD):
— AES-128 Counter Mode On-the-Fly Decryption
— Hardware support for unwrapping “key blobs”
— Functionally acts as a slave sub-module to the FlexSPI
• Secure Non-Volatile Storage (SNVS):
— Secure real-time clock (SRTC)
— Zero Master Key (ZMK)
— Tamper protection
— DryICE
• Secure always-on RAM (4 KB)
• Secure key management and protection
— Physical Unclonable Function (PUF)
— UnDocumented Function (UDF)
— Built-in Manufacturing Protection Hardware
• Secure and trusted access control




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About NXP Semiconductors


NXP Semiconductors is a publicly traded multinational company that designs, develops, and manufactures a wide range of semiconductors and integrated circuits for various applications, including automotive, industrial, communications, and consumer markets.

The company was founded in 2006 and is headquartered in Eindhoven, Netherlands.

NXP offers a broad portfolio of products, including microcontrollers, microprocessors, secure authentication ICs, power management ICs, RF and microwave components, and sensor solutions, among others.

The company's products are designed to be energy efficient, secure, and reliable, and are used in a variety of applications, including automotive systems, industrial automation and control, smart homes and buildings, and connected devices.

NXP is dedicated to innovation and customer satisfaction, and is committed to providing its customers with the best semiconductor solutions to meet their needs.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.




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