FEATURES
Low resistance/inductance packaging
Reduced form factor, Chip Scale Package (CSP)
CMOS, GaN and SiC compatible
Integrated power building block
Reduced thermal and electrical interfaces
Direct connection of the source or drain to the PCB
High percent of conductive material within the volume of the package of 30-70%
Low resistance (Rds), low inductance (Lds) and good capacitive (Ciss) performance compared to other discrete packages
Custom and standard pin layouts in a dual-sided power package

Applications
PowerCSP™ is suitable for power applications designed for low on-resistance and high-speed-switching MOSFETs such as:
Telecom/Data centers
Electric and hybrid electric vehicles
DC/DC conversion