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SIP Datasheet (PDF) - Amkor Technology

SIP Datasheet PDF - Amkor Technology
Part # SIP
Download  SIP Download
File Size   2138.93 Kbytes
Page   5 Pages
Manufacturer  AMKOR [Amkor Technology]
Direct Link  http://www.amkor.com
Logo AMKOR - Amkor Technology
Description SiPs as multi-component, multifunction products in an IC package.

SIP Datasheet (PDF)

Go To PDF Page Download Datasheet
SIP Datasheet PDF - Amkor Technology

Part # SIP
Download  SIP Click to download

File Size   2138.93 Kbytes
Page   5 Pages
Manufacturer  AMKOR [Amkor Technology]
Direct Link  http://www.amkor.com
Logo AMKOR - Amkor Technology
Description SiPs as multi-component, multifunction products in an IC package.

SIP Datasheet (HTML) - Amkor Technology


SIP Product details

APPLICATIONS
RF and wireless devices
▷ Power amplifiers, front-end module, antenna switch, cellular handset, cellular infrastructure, 5G NR, Sub-6 GHz, mmWave and Antenna in Package (AiP/AoP)
IoT, wearables/hearables and Machine to Machine (M2M)
▷ BLTe, Wi-Fi, UWB, LTE-M & NBIoT; controller and mixed-mode devices
Automotive applications
▷ Infotainment and sensory modules
Power modules
▷ DC/DC converter, PMIC, battery management and others
Computing and networking
▷ 5G networking, infrastructure and data center




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About Amkor Technology


Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.




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