Features and Benefits
• Selection of 157 nm, 193 nm,
248 nm, 308 nm, and 351 nm
wavelengths for full material
flexibility
• Superior pulse energy of up
to 750 mJ to enable effective
ablation at large field size
• Unrivalled pulse stability of
0.75%, rms to ensure high
fluence control
• Ultimate pulse control and
system parameter logging to
deliver smart and reproducible
thin films
Applications
• PLD – Pulsed Laser Deposition
• Thin Wafer Processing
• Laser Lift-Off/Debonding
• LA-ICP-MS